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Product Descriptions
General ZETA® System description
ZETA® 200mm and 300mm Spray Cleaning Systems are
designed for batch spray FEOL and BEOL cleaning processes at technology
nodes of 130nm and below. The systems deliver high performance
and low cost of ownership using centrifugal spray technology;
wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber. [48 words]
ZETA® 200mm and 300mm Spray Cleaning Systems are
designed for batch spray FEOL and BEOL cleaning processes at technology
nodes of 130nm and below. The systems use centrifugal spray technology;
wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber. FSI's versatile chemical delivery technology prepares
the chemicals at controlled composition and temperature and delivers
them directly onto the wafers. The ZETA® Systems are proven for
a wide range of applications, including FEOL resist strip and
post-ash clean, BEOL post-ash clean, salicide strip, C4 clean
and wafer reclaim. [88 words]
ZETA® 300FE
Spray Cleaning System
The ZETA® 300FE System is
a fully automated 300mm batch spray solution designed for FEOL
resist strip, post-ash clean,
salicide strip and wafer reclaim applications at technology
nodes of 130nm and below. The system uses centrifugal spray
technology;
wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber. [48 words]
The ZETA® 300FE System is
a fully automated 300mm batch spray solution designed for FEOL
resist strip, post-ash clean,
salicide strip and wafer reclaim applications at technology
nodes of 130nm and below. The system uses centrifugal spray
technology;
wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber. FSI's versatile chemical delivery technology prepares
the chemicals at controlled ratio and temperature and delivers
them directly onto the wafers. It employs FSI's on-wafer delivery
of fresh chemicals and single-pass chemistry, using concentrated
or advanced dilute and ozone chemistries, to deliver high process
performance and fast cycle time. [96 words]
ZETA® 200FE
Spray Cleaning System
The ZETA® 200FE System is
a fully automated 200mm batch spray solution designed for FEOL
resist strip, post-ash clean,
salicide strip and wafer reclaim applications at technology
nodes of 130nm and below. The ZETA® 200FE
System is also available in a semi-automated configuration
for processing 200mm and 150mm
wafers. The system uses centrifugal spray technology; wafers
undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber.
[65 words]
The ZETA® 200FE System is
a fully automated 200mm batch spray solution designed for FEOL
resist strip, post-ash clean,
salicide strip and wafer reclaim applications at technology
nodes of 130nm and below. The ZETA® 200FE
System is also available in a semi-automated configuration
for processing 200mm and 150mm
wafers. The system uses centrifugal spray technology; wafers
undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber.
FSI's versatile chemical delivery technology prepares the chemicals
at controlled ratio and temperature and delivers them directly
onto the wafers. It employs FSI's on-wafer delivery of fresh
chemicals and single-pass chemistry, using concentrated or
advanced dilute
and ozone chemistries, to deliver high process performance and
fast cycle time. [113 words]
ZETA® 300BE
Spray Cleaning System
The ZETA® 300BE System is
a 300mm fully automated batch spray BEOL post-ash clean solution
designed for use at technology
nodes of 130nm and below. The system uses centrifugal spray
technology; wafers undergo dry-in, dry-out processing in a
closed, nitrogen-purged
chamber. The ZETA® 300BE system
is also used in wafer-level packaging processes. [52 words]
The ZETA® 300BE System is
a 300mm fully automated batch spray BEOL post-ash clean solution
designed for use at technology
nodes of 130nm and below. FSI offers numerous copper/low-k
ready processes, including semi-aqueous solvent (SAS) and dilute
mineral
acid chemistries, as a result of our advanced process development
and industry partnerships. The system uses centrifugal spray
technology;
wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber. In addition to fresh chemical delivery, the system
can
have up to two temperature-controlled recirculated chemicals.
The ZETA® 300BE system is
also used in wafer-level packaging processes. [94 words]
ZETA® 200BE
Spray Cleaning System
The ZETA® 200BE System is
a 200mm fully automated batch spray BEOL post-ash clean solution
designed for use at technology
nodes of 130nm and below. The ZETA 200BE System is also available
in a semi-automated configuration for processing 200mm and
150mm
wafers. The system uses centrifugal spray technology; wafers
undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber.
[58 words]
The ZETA® 200BE System is
a 200mm fully automated batch spray BEOL post-ash clean solution
designed for use at technology
nodes of 130nm and below. The ZETA® 200BE
System is also available in a semi-automated configuration
for processing 200mm and 150mm
wafers. FSI offers numerous copper/low-k ready processes, including
semi-aqueous solvent (SAS) and dilute mineral acid chemistries,
as a result of our advanced process development and industry
partnerships. The system uses centrifugal spray technology;
wafers undergo dry-in,
dry-out processing in a closed, nitrogen-purged chamber. In
addition to fresh chemical delivery, the system can have up
to two temperature-controlled
recirculated chemicals. The ZETA® 200BE
System is also used in wafer-level packaging processes. [111
words]
MERCURY® Surface Conditioning System
The MERCURY® System is a
semi-automated batch spray processor designed for the 250nm
to 180nm technology nodes on a variety
of wafer sizes, including 200mm, 150mm, 120mm and 100mm.
The MERCURY® System, with
a small footprint, offers the benefits of low capital cost
and low cost of ownership through reduced chemical
and DI water usage. [55 words]
The MERCURY® System is a
semi-automated batch spray processor designed for the 250nm
to 180nm technology nodes on a variety
of wafer sizes, including 200mm, 150mm, 120mm and 100mm.
The MERCURY® System, with
a small footprint, offers the benefits of low capital cost
and low cost of ownership through reduced chemical
and DI water usage. The system uses centrifugal spray technology;
wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged
chamber. FSI's versatile chemical delivery technology prepares
the chemicals at controlled ratio and temperature and delivers
them directly onto the wafers. The tool can be used for a number
of applications, including FEOL resist strip and post-ash clean,
salicide strip, and wafer reclaim. [113 words]
ANTARES® CX Advanced Cleaning System
The ANTARES® System is a
fully automated, single-wafer, CryoKinetic system for 300mm
and 200mm wafers. This effective, benign dry
cleaning solution can be used for a variety of cleaning applications
in the damascene process. Current capabilities allow for the
removal
of particles 90nm and smaller for 130nm and below technology
nodes. [51 words]
The ANTARES® System is a
fully automated, single-wafer, CryoKinetic system for 300mm
and 200mm wafers. FSI's CryoKinetic processing
technology is an all-dry, non-reactive process that removes
particles through impact by high-velocity cryogenic Ar/N aerosol,
and reduces
defects without damaging the wafer surface, even on copper and
porous low-k films. This effective, benign dry cleaning solution
can be used for a variety of cleaning applications in the damascene
process, including post-dielectric etch, pre-metal deposition,
post-CMP, pre-dielectric deposition, and post-wafer probe. Current
capabilities allow for the removal of particles 90nm and smaller
for 130nm and below technology nodes. [96 words]
MAGELLAN® Immersion
Cleaning System
The MAGELLAN® Immersion
Cleaning System is designed to address the challenges of 300mm
manufacturing at 100nm and
below technology nodes. The innovative system offers short cycle
time, versatility and high process performance in a footprint
up to 40 percent smaller than the competition. Conventional
concentrated chemistries, as well as advanced dilute, ozone
and gas-to-chemical
chemistries, can be used in the system. [63 words]
The MAGELLAN® Immersion Cleaning
System is designed to address the challenges of 300mm manufacturing
at 100nm and
below technology nodes. The innovative system offers short cycle
time, versatility and high process performance in a footprint
up to 40 percent smaller than the competition. The system features
half-pitch, cassetteless processing of up to 52 wafers per batch.
Conventional concentrated chemistries, as well as advanced dilute,
ozone and gas-to-chemical chemistries that reduce cycle time
and
EHS impact, can be used in the system. The patented chemical
delivery technology enables users to easily handle a large,
changing product
mix, and with complete control through the system's reliable
robotics. The industry-leading performance of the system is
a result of
FSI's proprietary STG® rinse/dry
technology. [122 words]
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