Applications & Products

Apprecia Technology, Inc. presents at the Electronic Journal 186th Technical Symposium

At this year’s meeting, held at the Kokuyo Hall in Shinagawa, Tokyo on August 28, 2008, Apprecia Technology, Inc., FSI’s partner and distributor in Japan, presented “Advanced Surface Cleaning Technology Required for Beyond 32nm Device Generation.” This paper was presented by Kenji Shibata, Apprecia Technology Senior Director. Mr. Shibata’s presentation described some of the 32nm cleaning challenges and FSI solutions to meet those challenges such as FSI’s ViPR™ Technology for both implanted photoresist stripping and metal stripping for salicide formation as well as FSI’s CryoKinetic Technology for chemical-free, all-dry particle removal.

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Products Wafer Size (mm) Applications
    FEOL Critical Clean & Etch FEOL All-Wet Resist Strip & Clean Silicide Metal Strip BEOL Strip & Clean Particle/Defect Removal Resist Processing
ORION®
Single Wafer Cleaning System
300            
ANTARES®
Single Wafer Cryokinetic System
200/
300
           
ZETA®
Batch Spray System
200/
300
           
ZETA®
Semi-Auto Batch Spray System
≤200            
MERCURY®
Semi-Auto Batch Spray System
≤200            
MAGELLAN®
Batch Immersion System
200/
300
           
POLARIS®
Micro Lithography Cluster
N/A