Applications & Products

FSI Sponsors and Presents at the 2008 9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces
FSI’s contributed presentations were held as follows:

Session 2: FEOL Cleaning

15:00 – 15:15 “Advances on 45nm SiGe-Compatible NiPt Salicide Process” Yi-Wei Chen, Nien-Ting Ho, Jerander Lai, T.C. Tsai, C.C. Huang, S.F. Tzou, United Microelectronics Corp., Taiwan James M.M. Chu, FSI, Taiwan.

Session 5: FEOL: POST I/I PR STRIP

11:15 – 11:30 “Steam-Injected SPM Process for All-Wet Stripping of Implanted Photoresist” David DeKraker, Jeffery Butterbaugh, Kurt Christenson, Thomas Wagener, FSI International, USA

For more information on either of these presentations, click here.

 

 

Products Wafer Size (mm) Applications
    FEOL Critical Clean & Etch FEOL All-Wet Resist Strip & Clean Silicide Metal Strip BEOL Strip & Clean Particle/Defect Removal Resist Processing
ORION®
Single Wafer Cleaning System
300            
ANTARES®
Single Wafer Cryokinetic System
200/
300
           
ZETA®
Batch Spray System
200/
300
           
ZETA®
Semi-Auto Batch Spray System
≤200            
MERCURY®
Semi-Auto Batch Spray System
≤200            
MAGELLAN®
Batch Immersion System
200/
300
           
POLARIS®
Micro Lithography Cluster
N/A