ZETA® Batch Spray Cleaning Systems
ViPR™ Technology for resist stripping productivity improvement —this enhancement enables an ash-free, one-step process that dramatically decreases material losses caused by multi-step, ash-wet methods, thereby reducing cost, time and process complexity.
ViPR™ Technology for silicide integration device yield improvements—this enhancement enables metal stripping following salicide processes to effectively remove unreacted metal without attacking the salicide and makes possible advanced NiPt salicide processes that use lower annealing temperatures to reduce junction leakage, resulting in improved yields.
ANTARES® Single Wafer Cryokinetic System
N2 Chamber Purge—this enhancement prevents moist ambient air from entering the process chamber during wafer transfer resulting in a reduction or elimination of cumulative particle adders and potential throughput improvements.
Auto DEWAR Drain—this enhancement improves uptime by automating the function of draining the dewar, resulting in a reduction in the time needed to perform preventive maintenance each month.
Auto Leak Detection—this enhancement improves uptime and MTTR by automating leak detection in the foreline, chuck vacuum valve, differential pressure seal, lift pin assembly, cover seal, or in a weak pump. Leak detection is achieved with tests performed at programmable intervals.