Chilled Water Conditioner Upgrade: Cost effective, environmentally safer than Biocide or Ethylene Glycol.

Coat Thickness Stability Upgrade Kit: Improves day to day coat thickness variation resulting in lower down time for adjustments.

Conditioning Solvent Upgrade: Reduce resist usage 45% without compromising manufacturing, Reduces cost of ownership.

Develop Exhaust Rinse Upgrade Kit (P2000, P2100/2200): Maintains clean exhaust manifold and proper exhaust levels over time.

Digital Vacuum Sensor Upgrades (HMDS, Bake, Chill, Spinner): Improves wafer handling reliability.

RX-90 Digital Vacuum Sensor and Filter Upgrade Kit (P2000, P2100/2200): Improves wafer handling reliability.

Dispense Arm Limit Adjustment Kit (P1000, P2000, P2100/2200): Provides more adjustment accuracy and improved repeatability.

Plate Refurbishment (P2500 Bake/Chill, Prime/Chill; P3500 Bake): Cost effective replacement parts. Upgraded to current standards.

Dual Wafer Size Conversion Upgrade (150/200 mm): Provides fab flexibility and improves throughput of larger wafers.

High Flow Exhaust Kit (Exhaust Booster Fan) 60hz (P2500, P3500): Increases exhausting and reduces defectivity.

Lowered Backlight Upgrade (P2500, P3500): Improves wafer handler movement and system throughput.

Off Center Handler Upgrade (P2000, P2100/2200): Auto correct 95% of misaligned wafers.

PELA Plus!™: Fast and efficient POLARIS^® system health monitoring system.

Point-Of-Use (POU) Heater Upgrade: Reduces orifice clogging and improves defectivity.

Radial Dispense Manipulator Upgrade Kit (P2100/2200): Improves process repeatability.

RX-90 Robot Refurbishment Program: Provides a low cost refurbished robot exchange program.

Solvent Exhaust Rinse Upgrade Kit (P1000, P2000, P2100/2200): Maintains clean exhaust line and ensures exhaust stability over time.

Spinner Bowl Rinse Upgrade (P2100/2200): Maintains clean spinner cup leading to lower defectivity and improved bowl life.

Spinner Exhaust Assembly Upgrade Kit (P2000): Improves measurement and control of exhaust levels in spin module.

Spinner Heat Exchanger Re-route Upgrade Kit (P2000, P2100/2200): Improves resist control.

Spinner Point-of-Use Heater Mixing Upgrade Kit (P2000): Provides stable temperature control of process media.

Subassembly Refurbishment Program: Renewal service to replace worn out IDI pumps, bake, chill and prime plates at a fraction of new.

TTU™ (Transient Thermal Uniformity) Hotplate (Bake) Design: High performance bake plate available on 2500 & 3500 systems improves CD's up to 50%.

Wafer Size Conversion Kit: Enables simple wafer size changes.

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