BEOL Strip and Clean processes for copper technology involve cleaning after dielectric etching to form the canals and vias that are later filled with diffusion barrier layers and copper. The cleaning step must remove all etching and ash residue, including organic residues, oxidized metallic residues and particulate contamination, without attacking the patterned metal lines or dielectric, or causing physical damage to structures on the wafer surface.
Benefits
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- FSI's systems are designed to use off-the-shelf tool prepared chemical mixtures or on-tool blending of dilute acids and additives.
- FSI's systems can be operated in both single pass and re-circulated modes.
- FSI's proprietary blending technology allows for very precise, repeatable control.
- FSI's spray cleaning systems maintain very low oxygen atmospheres that minimize unwanted metal etching or galvanic corrosion.
