The MERCURY® Spray Cleaning Systems provides IC manufacturers with economical front-end-of-line cleaning processes down to 180mm technology node. This semi-automated batch spray processor is designed for 200mm and smaller wafers. With over 1,000 MERCURY® batch-spray cleaning systems shipped, they continue to meet the needs of low cost IC manufacturing worldwide.
Benefits
- Very high throughput and small footprint for low capital investment
- Multiple applications can be run on same tool resulting in decreased capital requirements
- Lowest cost single pass chemistries by combining on-tool blending with spray dispense
Publications
"Strategies for Second-Hand Equipment in China"
While used equipment has been widely used in China and contributing to a strong advantage in low-cost manufacturing, the Chinese IC industry also needs technology upgrade to continue the rapid growth. Can 2nd hand equipment continue to be useful at the next nodes? We offer strategies and examples from our work with leading IC makers worldwide.
Download English Version PDF Download Simplified Chinese Version PDF"Rinsing: A Critical Process in Particle Removal"
By: Kurt Christenson
Rinsing is a critical process in particle removal. This paper examines fundamental mechanisms of rinsing and applies these principals to the development of ramped rinsing in spray cleaning. Results include better particle removal and reduced water consumption.
“An Integrated Wet Chemical Etch-Strip-Clean Sequence,” Solid State Technology
An investigation was conducted to determine the source of a yield-limiting defect identified on all product types at a wafer fab. The defect was isolated to patterning operations in the frontend section of the device process where a conventional multistep sequence was used. The problem was traced to a wet chemical buffered oxide etching step and attributed to drying wafers before ashing the resist film.
Download PDFApplications
- FEOL Critical Clean and Etch
- FEOL Strip and Clean
- MOL Strip and Clean
- Defect Removal