FSI International, Inc. Announces First Quarter Fiscal 2006 Financial Results

The Company Reports Higher Than Expected Gross Profit Margins and Lower Than Expected Operating Expenses

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FSI International, Inc. to Web Cast Live its December 20 Teleconference on First Quarter Fiscal 2006 Financial Results

MINNEAPOLIS (December 8, 2005) -- -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, will hold its quarterly conference call to discuss first quarter fiscal 2006 results on Tuesday, December 20, 2005, at 4:30 p.m. Eastern Time (3:30 p.m. Central Time).

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FSI International, Inc. Announces Preliminary Fourth Quarter and Fiscal Year 2005 Financial Results

The Company Ended the Year with $32 Million in Cash, Cash Equivalents and Marketable Securities and Orders of $26 Million in the Fourth Quarter of Fiscal 2005 Increased as Compared to the Prior Quarter

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FSI International, Inc. to Web Cast Live its October 18 Teleconference on Preliminary Fourth Quarter and Full Year Fiscal 2005 Financial Results

MINNEAPOLIS (October 14, 2005) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, will hold its quarterly conference call to discuss preliminary fourth quarter and full year fiscal 2005 results on Tuesday, October 18, 2005, at 4:30 p.m. Eastern Time (3:30 p.m. Central Time).

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ITRS Public Conference Reveals Continuing Surface Preparation Challenges

On July 13, 2005, the International Technology Roadmap for Semiconductors held its annual public conference at Semicon West. All aspects of semiconductor design and manufacturing were presented as the ITRS prepares for publication of the 2005 roadmap at the end of this year. It is evident that the future of semiconductor manufacturing will continue to present significant challenges in the area of surface preparation.

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FSI International Launches the EcoBlend™ Process Series of Cost-Effective Dilute Acid Cleaning Solutions for Post-Ash Residue Removal

MINNEAPOLIS (August 2, 2005) -- FSI International, Inc. (Nasdaq: FSII) today announced a new family of dilute acid cleans, called the EcoBlend™ Processes, for cost-effective and environmentally friendly removal of post-ash residues. Used for aluminum and tungsten interconnect cleaning applications, this family of chemical processes gives IC manufacturers alternatives to high-cost specialty chemicals.

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