MINNEAPOLIS (June 30, 2005) -- FSI International, Inc. (Nasdaq: FSII) today announced new cleaning processes to meet the needs of leading IC makers well ahead of the International Technology Roadmap for Semiconductors (ITRS) guidelines for material loss. The ITRS calls for a maximum material loss per cleaning cycle of 0.4 angstrom at the 45nm technology node, while semiconductor manufacturers indicate their requirements are closer to 0.1 angstrom.
Sessions Offer Attendees Expert Insight Into Emerging Surface Preparation Trends
Third Quarter Fiscal 2005 Orders Increased 43 percent to $24.6 million as Compared to the Second Quarter Level
MINNEAPOLIS (June 21, 2005) -- FSI International, Inc. (Nasdaq: FSII) today announced strong activity in the third quarter of fiscal 2005 from leading IC manufacturers in Europe, Asia-Pacific, Japan and the United States for its ANTARES® CryoKinetic Cleaning Systems.
MINNEAPOLIS (June 13, 2005) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, will hold its quarterly conference call to discuss third quarter and first nine months fiscal 2005 results on Tuesday, June 21, 2005, at 4:30 p.m. Eastern Time (3:30 p.m. Central Time).
MINNEAPOLIS (March 22, 2005)--FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, today reported financial results for the second quarter of fiscal 2005 and for the first six months ended February 26, 2005.