MINNEAPOLIS (Dec. 18, 2007) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, today reported financial results for its fiscal 2008 first quarter ended November 24, 2007.

MINNEAPOLIS (December 12, 2007) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, will hold its quarterly conference call to discuss first quarter fiscal 2008 results on Tuesday, December 18, 2007, at 4:30 p.m. Eastern Time (3:30 p.m. Central Time).

MINNEAPOLIS (December 11, 2007) -- FSI International, Inc. (Nasdaq: FSII) today announced it has adapted the FSI ViPR™ technology to successfully remove unreacted metal films after salicide formation. By implementing this new process, IC makers can achieve dramatic reductions in chemical usage and capital requirements for cobalt, nickel and nickel platinum silicide integration schemes. FSI ViPR™ technology is available on new FSI ZETA^® Spray Cleaning System orders and as an upgrade to more recently installed systems in the field.

MINNEAPOLIS (Oct. 16, 2007) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, today reported financial results for the fiscal 2007 fourth quarter and the fiscal year ended August 25, 2007.

MINNEAPOLIS (October 9, 2007) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, will hold its quarterly conference call to discuss fourth quarter and full year fiscal 2007 results on Tuesday, October 16, 2007, at 4:30 p.m. Eastern Time (3:30 p.m. Central Time).

Jeffery W. Butterbaugh, FSI International Chief Technologist

All-wet resist stripping has been a major focus of cleaning equipment suppliers for the past two years. The desire by IC manufacturers for all-wet photoresist stripping is driven by a need to decrease material loss and eliminate the side effects of plasma ashing during the photoresist stripping process.