First quarter orders increase 27 percent from fourth quarter fiscal 2009 level as microelectronics industry conditions improve

MINNEAPOLIS (Dec. 22, 2009) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, today reported financial results for its fiscal 2010 first quarter ended November 28, 2009.

MINNEAPOLIS (December 15, 2009) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, will release its financial information for first quarter fiscal 2010 results on Tuesday, December 22, 2009, after market close and will host a conference call later the same day at 4:30 p.m. Eastern Time (3:30 p.m. Central Time) to discuss the results.

The Company generated $1.5 million in cash from operations in the fourth quarter of fiscal 2009, maintained $12 million in cash and no debt at the end of fiscal 2009

MINNEAPOLIS (Oct. 27, 2009) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, today reported financial results for the fiscal 2009 fourth quarter and the fiscal year ended August 29, 2009.

MINNEAPOLIS (October 20, 2009) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, will release its financial results for fourth quarter and full year fiscal 2009 on Tuesday, October 27, 2009, after the market close. The Company is hosting a conference call at 4:30 p.m. Eastern Time (3:30 p.m. Central Time) the same day to discuss the results.

This system will be integrated into the fabrication of 32nm BEOL copper/low-k interconnects and be used in 22nm development activities

MINNEAPOLIS (October 7, 2009) -- FSI International, Inc. (Nasdaq: FSII) a leading supplier of wafer processing, cleaning and surface conditioning equipment for semiconductor manufacturing, announced today the receipt of a repeat order for the FSI ORION^® single wafer cleaning technology from a major U.S. based semiconductor manufacturer.

All wet ViPR™+ method strips highly implanted photoresist without ashing and completely removes unreacted metal in low temperature platinum salicide processes

MINNEAPOLIS (October 6, 2009) -- FSI International, Inc. (Nasdaq: FSII), a leading supplier of wafer processing, cleaning and surface conditioning equipment for semiconductor manufacturing, announced today the U.S. Patent and Trademark Office has awarded the company a patent for its ViPR™+ cleaning technology.