All-wet photoresist stripping technology eliminates asher-induced defects.
MINNEAPOLIS (March 24, 2009) — FSI International, Inc. (Nasdaq: FSII) a leading supplier of wafer processing, cleaning and surface conditioning equipment for semiconductor manufacturing, announced today that a major memory manufacturer has extended the use of its ZETA® Cleaning System with proprietary ViPR™ all-wet, ashless cleaning technology to NAND production.
Many device manufacturers are already familiar with the benefits of using FSI’s ZETA ViPR technology for salicide formation. This IC maker evaluated the tool’s all-wet photoresist removal capability to eliminate an asher-induced defect in advanced NAND fabrication. The customer confirmed in manufacturing the tool’s ability to strip photoresist without ashing and has now replaced a two-step, ash-clean process with a single-step. In addition to reduced defectivity, users are benefiting from decreased total factory turn around time by going to a one-step process.
“NAND technology continues to set the pace for shrinking device dimensions,” said Don Mitchell, FSI’s president and CEO. “Expanding the ZETA ViPR for NAND manufacturing verifies the critical value-add of all-wet stripping in advanced processes— value that will only increase as device dimensions continue to shrink. It’s rewarding to provide our customers with a truly differentiated process that can reduce cycle time and capital outlay and lower operating costs.”
The growing acceptance of the ZETA ViPR technology results from its ability to eliminate the ashing process from most photoresist stripping sequences and to effectively remove residual metals following advanced salicide formation. For photoresist stripping, the unique chemical reactivity achieved by the ZETA ViPR process allows it to remove the photoresist by wet chemical action alone for all but the most extreme implant conditions. Not only does this eliminate the time and cost associated with ashing, ViPR also eliminates asher-induced damage and dopant/material losses. For metal stripping following salicide formation, the ZETA ViPR process effectively removes unreacted metal without attacking the salicide. In particular, it integrates successfully with the most advanced NiPt salicide processes that use lower annealing temperatures to reduce junction leakage, resulting in improved process yields.
FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the Company’s broad portfolio of cleaning products, which include batch and single wafer platforms for immersion, spray and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. FSI maintains a web site at http://www.fsi-intl.com.