MINNEAPOLIS (December 29, 2010) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, today announced that the company will present on Thursday, January 13, 2011 at the 13th Annual Needham Growth Conference. The conference is being held at the New York Palace Hotel, 455 Madison Avenue. FSI's presentation will begin at 9:20 a.m.EST. 

First quarter orders increased 10 percent to $32.3 million as semiconductor industry expansion plans progressed in anticipation of increased demand for microelectronics

MINNEAPOLIS (December 21, 2010) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, today reported financial results for its fiscal 2011 first quarter ended November 27, 2010.

MINNEAPOLIS (December 14, 2010) -- FSI International, Inc. (Nasdaq: FSII), a manufacturer of capital equipment for the microelectronics industry, will release its financial information for first quarter fiscal 2011 results on Tuesday, December 21, 2010, after market close and will host a conference call later the same day at 4:30 p.m. Eastern Time (3:30 p.m. Central Time) to discuss the results. 

Order represents market acceptance of ORION technology for 28nm device application

MINNEAPOLIS (December 14, 2010) -- FSI International, Inc. (Nasdaq: FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today the receipt of an order for its FSI ORION^® single wafer cleaning platform from a major leading Asian semiconductor manufacturer. The order represents acceptance of the evaluation tool shipped in late 2009 for front-end-of-line (FEOL) programs. The system is now qualilfied in ashless all-wet photoresist strip and silicon etch for the production of 28nm logic devices. Revenues for the four-chamber evaluation system and four-chamber expansion model is expected to be recognized in the second quarter of fiscal 2011.

MINNEAPOLIS (November 23, 2010) -- FSI International, Inc. (Nasdaq: FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today that it shipped its FSI ORION^® single wafer cleaning system to another leading Asian semiconductor manufacturing customer. The qualification system will be used in ashless all-wet photoresist strip and wet metal etch applications for the development and production of memory devices. Revenues from shipments of production use systems are expected to begin in the second half of 2011.

MINNEAPOLIS (November 3, 2010) -- FSI International, Inc. (Nasdaq: FSII), a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced today that a leading Asia-based logic device producer has placed additional orders for multiple ANTARES^® CryoKinetic cleaning systems. Once delivered, this will significantly expand the platform’s installed base at this customer. The logic chip provider currently uses the ANTARES system for various BEOL particle removal processes, including inline probe testing. Unlike aqueous technologies, Cryokinetic cleaning technology is uniquely qualified for this application because of its all-dry defect removal method. The systems are expected to ship in the second and third quarter of fiscal 2011. The dual process chamber ANTARES systems typically range in price from $1.8 to $2.3 million, depending on configuration.