FSI // Knowledge Services™ Seminar Series Launches in US.
Focus: What's driving productivity and performance for 65nm?
Hot Topic
Cleaning with Low Material Loss Requires an Integrated Approach
FSI in the News
FSI International Successfully Implements Its PlatNiStrip(tm) Process at Leading IC Makers for 65nm Production
Product Updates
The MAGELLAN® System Delivers Proven Process Performance for 65nm Technology
The MAGELLAN® Immersion Cleaning System has been qualified for 65nm baseline manufacturing. Top chipmakers using the system have confirmed notable process performance. The tool's 65nm process performance is highlighted by one customer's results for an oxide removal and surface preparation process.
Recover Lost Yield and Revenue Using CryoKinetic Cleaning After DC Parametric Testing
For many years, device manufacturers chose between doing parametric testing after completing the front-end transistor formation steps or waiting to test until after completing the expensive back-end metallization processing steps. It is a difficult decision largely because wafers tested in mid-flow are considered too contaminated to return to the manufacturing line and must be scrapped. Now IC manufacturers can recover lost wafers and subsequent revenues without giving up valuable in-line data when they use FSI's ANTARES® CryoKinetic Cleaning Technology.
Customer Care News
FSI's Class 1 Lab Delivers Proven Processes and Rapid Results
Over 25 years ago, FSI realized the importance of advanced applications development and established one of the industry's first equipment supplier-based laboratories. Today FSI International operates a state-of-the-art process lab in a Class 1 clean room at its Chaska, Minnesota, USA headquarters. Customers often comment that its leading-edge capabilities are a testimony to FSI's technology leadership and customer partnering philosophy. This proven facility can offer IC makers distinct advantages:
- Reduced development time
- Improved production readiness by pre-qualifying processes
- Facilitate optimizing in-field implementation
Asia Region Update – As the Asia Market Grows, so Grows FSI
As we near Semicon China (March 21-23), it is worthwhile to review the Asia IC industry development and outlook, and how FSI is positioned to support this significant region.
In 2004, the Chinese IC industry grew 55% year-over-year, with revenue of $6.8 billion, which consists of 33.2% from IC manufacturing, 14.9% from IC design and 51.9% from packaging and test.[1] In 2006, the Chinese IC industry will continue to mature, in particular for IC manufacturing as China shifts more attention to advanced technologies to win higher ASPs. With 90nm processing already a reality in China, predictions are for 65nm to come on strong in 2006.
New Publications
FEOL and BEOL Strip and Clean
Jeff Butterbaugh, FSI Chief Technologist, interviewed by Aaron Hand, Managing Editor, Semiconductor International, “Photoresist Strip Faces Increasing Selectivity Challenges,” published in Semiconductor International, January 2006
FEOL Critical Clean and Etch and BEOL Post-ash Clean and Photoresist Strip
"Reducing Time in Batch Cleaning," by Jeff Butterbaugh, FSI, published in European Semiconductor, October 2005
"Strategies for Cycle Time Reduction in Batch Cleaning," by Jeff Butterbaugh, FSI, published in Semiconductor Technology, August 2005
FEOL Particle Removal
“Cryogenic Aerosol for Zero-Damage Cleaning,” by Jeffrey Lauerhaas and Carlos Morote, FSI and Jean-Philippe Ple, Altis, published in Semiconductor International, December 2005
Looking Ahead
FSI's Tradeshow Program Refocused
FSI recently completed a market study to determine our customers' preferred method for information exchange with us. They overwhelmingly told us to provide information of high value and to use their time effectively and efficiently.
Based on this study and the feedback received during our 2005 FSI Knowledge Services™ Seminar Series held in Asia and Europe, FSI will expand on these seminars by launching a 2006 USA series. As a result of this refocus, FSI will not have a booth at SEMICON West.
During show week, FSI sales representatives and management will be in San Francisco – in force – to hold pre-scheduled customer meetings at Moscone Center or at nearby convenient venues.
Please feel free to contact your local FSI sales representative if you have any questions about the show or the 2006 USA Knowledge Service(tm) Seminar Series.
SEMICON China
Visit FSI - your surface conditioning partner - at SEMICON(r) China, Booth #3643, Hall W3, Shanghai New International Expo Center, March 21-23, 2006.
SEMATECH Surface Cleaning and Preparation Conference
Listen to FSI present the following papers at the SEMATECH Surface Cleaning and Preparation Conference, May 4-5, 2006, Austin, Texas.
"International Technology Roadmap for Semiconductors – Front End Processes," by, Jeffrey W. Butterbaugh, FSI International
"Characterization and Damage-Free Cleaning of FinFet Structures," by Rinn Cleavelin, Texas Instruments; Weize Xion, Texas Instruments; Koki Mochizuki, KLA-Tencor; Kara Sherman, KLA-Tencor; Thomas Schulz, Infineon; Klaus Schruefer, Infineon; Paul Patruno, SOITEC; Jeffrey M. Lauerhaas, FSI International,
17th Annual IEEE/SEMI(r) Advanced Semiconductor Manufacturing Conference (ASMC)
Listen to FSI present Damage-Free Cryogenic Aerosol Clean Processes, presented by Hong Lin, Kelly Chioujones and Tim Freebern, Chienfan Yu, IBM Systems and Technology Division; Jeff Lauerhaas, FSI International, at the ASMC Conference, May 22-24, 2006, Boston, Massachusetts.