Product Updates

MAGELLAN^® Immersion Cleaning System Nitride Etch Demonstrates Unrivaled Selectivity and Uniformity

Nitride etch using the MAGELLAN^® immersion cleaning system has demonstrated unrivaled selectivity and uniformity. In selectivity tests, the system has repeatedly removed up to 3,500Å of nitride with no measurable oxide loss. Uniformity within wafers averages 1.7 percent at one sigma for 300 mm wafers. Added particles per run is nearly zero for 90nm and greater particles. This excellent performance can be attributed to a number of design features of the MAGELLAN system.

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ANTARES^® CryoKinetic Cleaning System Avoids Copper Pitting in Via Formation Process

FSI's ANTARES^® CryoKinetic cleaning system uses a high-velocity argon/nitrogen cryogenic aerosol to remove surface particles and other residue. Customers have reported using the technique at many points throughout both FEOL and BEOL processes. A recent study demonstrated the value of CryoKinetic cleaning in removing particulates left by the via etch and ash process. Chemical treatments used at this point are known to cause defects as they attack underlying copper structures through pinholes in the protective etch stop layer. Water treatments cause similar corrosion problems and introduce moisture into porous low k dielectrics. The ANTARES CryoKinetic process is completely dry, non-reactive and non-contact. It provides high particle removal efficiency (PRE) without damaging copper or adding water to the dielectric.

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ZETA^® G3 Spray Cleaning System Accepted and in Production Qualification

The first ZETA^® G3 spray cleaning systems, shipped March 2006, have been accepted and are in the process of production qualification. The ZETA G3 is the third generation on the ZETA platform. Enhancements to the platform's robotics and cassette handling capabilities have yielded a 30 percent increase in post-ash clean throughput compared to the previous-generation platform. The ViPR™ all wet strip process for highly implanted photoresist, first introduced with the ZETA platform, has passed initial production testing at several implant levels. The ViPR process yields more than 50 percent reduction in cycle time compared to combined ash and clean processes for the same step. Continuing qualification of the ViPR process on additional implant levels will provide integrated process yield improvement data over the next few months.

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Customer Care News

FSI Presents Advanced Cobalt Stripping Process for High Yield Salicide Formation

During the SI China Yield Enhancement Seminar in Shanghai, China on May 25, IC makers and equipment suppliers presented discussions of numerous aspects of yield enhancement, including yield management approaches, yield killers at 45nm and beyond, and the latest defect detection and yield management technologies.

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FSI Knowledge SERVICES™ Seminar Series Brings Meaning to Addressing Supplier-Customer Relationships for the Era of "Scaling by Innovation"

Since the 2004 launch of FSI's Knowledge Services Seminar Series, over 1000 IC manufactures worldwide have participated in these very informative day-long seminars, and FSI is pleased to bring added value to the supplier-customer relationship.

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FSI Knowledge Services Seminar Series -- UK, Germany, France and Israel - HOLD THE DATE

Hold the date for a seminar near you - FSI will be holding its next Knowledge Services Seminar Series in during the month of October in the following locations: England, Germany, Israel and France.

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