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KSS agenda, venue and registration information.
Hot Topic
Controlling Dissolved Oxygen in Cleaning Processes
Dissolved gases have long been known to have significant impact on wet cleaning processes. Dissolved oxygen in rinse water contributes to surface oxidation and watermark formation during wafer drying [1-2]. Dissolved gases can affect megasonics processes and are often controlled in order to optimize particle removal efficiency and prevent pattern damage [3]. In addition, dissolved CO2 is well-known to form carbonic acid, affecting the pH of liquid cleaning solutions. More recently, there is an increased concern about the effect of dissolved oxygen when cleaning surfaces with different metals exposed.
FSI in the News
FSI International Customers Confirm Yield Gains Achieved Using FSI Cleaning Technologies in Advanced IC Production
Findings presented at FSI’s Knowledge Services™ Seminar series in May are now available
FSI announces that during its Knowledge Services™ Seminar Series held last month in Israel, Italy, France and Germany, several customer-authored presentations credited FSI cleaning technologies with contributing to significant manufacturing yield gains. In the presentations, FSI customers, including STMicroelectronics, Numonyx B.V., Tower Semiconductor LTD., Qimonda AG, and CEA Leti, described advanced processes enabled by FSI’s innovative cleaning products and presented data documenting yield gains in a variety of production applications.
FSI International’s ZETA® System ViPR™ Process Identified as a Key Technology for Ultra-High Dose Ion Implantation in CMOS Applications
FSI announces that a paper jointly presented by Hynix Semiconductor, Inc.; Varian Semiconductor Equipment Associates, Inc.; Nanometrics Incorporated and FSI identifies the ZETA® Spray Cleaning System with ViPR™ technology as a key step in the integration of ultra-high dose PLAD (plasma doping) ion implantation. The paper was presented at the 17th International Conference on Ion Implantation Technology held June 8-13, 2008, in Monterey, California. The ViPR process is uniquely-capable of removing photoresist hardened by exposure to high-dose ion bombardment without the surface damage and material loss caused by traditional techniques.
FSI Ships Single Wafer Cleaning Technology Selected by a Major Semiconductor Manufacturer for Development of 32nm BEOL Cleaning Processes
FSI announces that it shipped its single wafer wet cleaning technology to a major semiconductor manufacturer for the development of back-end-of-line (BEOL) cleaning capability for 32nm IC manufacturing. After a thorough review of competitive alternatives, this customer determined that FSI’s technology best met its anticipated new requirements for 32nm device manufacturing. For the development program, FSI has shipped an evaluation ORION™ Single Wafer Cleaning Cluster.
Product Updates
ZETA® System Improves Cobalt Salicide Process Yields for Numonyx
At FSI’s recent Knowledge Services™ Seminar series Enrico Bellandi described the success he and his colleagues at Numonyx had in reducing the defectivity and improving the yield of their cobalt salicide process using the ZETA® spray cleaning system. Reduction of contact and gate conductor resistance through self-aligned silicide formation, also known as “salicide,” is a well-known integrated circuit manufacturing module.
STMicroelectronics Describes ZETA® System ViPR™ Process in Metal Stripping for Nickel Platinum Silicide
At the recent FSI Knowledge Services™ Seminar series Stephane Zoll and Bruno Imbert of STMicroelectronics described challenges and solutions of metal stripping for nickel platinum (NiPt) salicide formation using a process based on FSI’s ZETA® System ViPR™ technology. The process leverages the FSI’s proprietary high temperature capabilities to strip unreacted NiPt with a sulfuric acid/hydrogen peroxide chemistry.
Yield improvement using the MAGELLAN® System’s flexibility to achieve recipe optimization
In their FSI Knowledge Services™ Seminar presentation, Nirit Sofer and Lev Sherbelis of Numonyx confirmed significant yield gains in flash memory production after optimizing the SC1 cleaning process to increase particle removal efficiency (PRE), noting that the detailed optimization was enabled by the MAGELLAN® System’s flexible but precise recipe control of multiple process parameters.
Customer Care News
Customers Confirm Yield Gains Achieved Using FSI Cleaning Technologies in Advanced IC Production during FSI KSS Seminars Held in Europe and Israel
Over 200 attendees participated in FSI’s Knowledge Services™ Seminar Series - EMEA held in May 2008 in Israel, Italy, France and Germany. Several customer-authored presentations credited FSI cleaning technologies with contributing to significant manufacturing yield gains. In the presentations, FSI customers, including STMicroelectronics, Numonyx B.V., Tower Semiconductor LTD., Qimonda AG, and CEA Leti, described advanced processes enabled by FSI’s innovative cleaning products and presented data documenting yield gains in a variety of production applications.
Hold the Date for our ASIA FSI Knowledge Services™ Seminar Series in November 2008
FSI is working with the leading IC manufacturers around the world to generate world class innovations on FSI tools and processes. Since 2004, FSI’s Knowledge Services Seminar™ Series (KSS) has been the perfect platform for Asia-based IC manufacturers to learn about the latest IC manufacturing and business practices from FSI and other Asia-based IC manufacturers.
FSI Expands its Applications and Sales Staff in Asia and Europe
FSI is very pleased to announce Perry Ko has joined FSI Korea as Applications Manager, Cron Wu has joined FSI Taiwan as Sales Manager and Martin Kipping has joined FSI Europe as Applications Engineer.
FSI was a Proud Sponsor of the 5th Semiconductor International China Wafer Cleaning Seminar Held 15 October 2008 in Shanghai
The SI China conference theme was Applications and Challenges in Cleaning Technology at the Age of Deep Submicron and emphasized practical and next-generation technologies, including:
FSI Sponsors and Presents at the 2008 9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces
The Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) objective is to increase the level of understanding on ultra-clean processing technology in all steps of IC-production.
FSI co-authors paper at the 17th International Conference on Ion Implantation Technology (IIT 2008) in Monterey, California, June 8-13, 2008
The International Conference on Ion Implantation Technology is held every two years at different locations around the world. This Conference Series is the premier world meeting for the presentation of the latest advances in all aspects of ion implantation. The Conference consists of invited presentations as well as selected contributed presentations and posters.
Apprecia Technology, Inc. presents at the Electronic Journal 186th Technical Symposium - Exhaustive Study for 2008 ULSI Surface Cleaning and Drying Technology - in Tokyo, August 28, 2008
Electronic Journal in Japan sponsors many technical symposia. Each year one of the symposia is focused on cleaning technology in IC manufacturing. In 2008, the focus of this symposium was on cleaning challenges for 45nm and 32nm technology generations.
New Publications
FEOL & BEOL Strip and Clean
"Resist Removal Walks a Tightrope," published in Semiconductor International, August 2008
FEOL Critical Clean and Etch and FEOL Strip and Clean
“Increasing Demands Require New Look at Wafer Cleans,” published in Semiconductor International, August 2008
Please visit the FSI Technical Library to view the latest papers available on FSI technologies.
Looking Ahead
Asia Knowledge Services™ Seminar Series
The next FSI Knowledge Services™ Seminar Series will be held in November 2008 in the following locations:
- Shanghai – 4 November
- Seoul – 6 November
- Singapore – 11 November
- Hsinchu – 13 November
- Taichung - 14 November