Since launching the first Knowledge Services™ Seminar Series (KSS) in Asia in 2004, the event has developed into a regularly scheduled, worldwide program. KSS has been held in Europe and the Middle East, the United States, and is now returning to Asia with a series of seminars to be held in:

• Seoul on April 11
• Singapore on April 13
• Shanghai on April 17
• Hsinchu on April 19
• Tainan on April 20 (does not include morning session)

The series will retain its popular daylong format with a morning short course and an afternoon of presentations from IC maker presentations describing their real-world problems and solutions and FSI experts on our latest products and technologies. You can attend both sessions, or you can attend just one, as they have independent content and focus.

Morning Session: Fundamentals of Particle Adhesion and Removal: This short course will review the state of the art in understanding the forces that control particle adhesion to surfaces in different media. Participants will acquire understanding of the effects of the particle (size, shape, roughness, composition and position), substrate (roughness and composition), and intervening medium (composition) on the resulting adhesion force. Participants will also learn which forces dominate the adhesion interaction at different conditions. Discussions of particle deformation at equilibrium as well as interactions between nondeformable particles and substrates will be featured.

• In Singapore and Seoul taught by Dr. Srini Raghavan, Professor of Materials Science and Engineering, University of Arizona.
• In Shanghai and Hsinchu by Dr. Stephen Beaudion, Professor of Chemical Engineering, Purdue University.
• The morning session is NOT offered in Tainan

Afternoon Session: The afternoon will kick off with engaging keynote speeches from IC makers looking at technology drivers, followed by a series of presentations on surface preparation and yield enhancement.

• Customer presentations from Magnachip, SMIC, UMC, Samsung, Hynix, Chartered.
• Surface preparation topics include: Ni and NiPt stripping, ash-free, all wet resist stripping, damage-free particle removal, ultra-low defectivity, defect removal and improved yield and selective nitride etch.

“These seminars signal a new era in collaborative communication and raise the bar for leading suppliers to provide ‘knowledge’ services,” said Don Mitchell, FSI chairman and CEO. “As a leading supplier with over 30 years of semiconductor industry experience, we want to offer our customers around the world an opportunity to exchange information on a variety of levels. Since 2003 FSI has had direct sales and marketing operations in all its global markets and we view these seminars as a natural extension of the type of technology sharing and frequent interaction that will increase our understanding of regional expectations and result in our better addressing customer’s needs.”

To view the seminar topics and request a copy of the presentation CD, Click here.