When: March 31 - April 2, 2008
Where: Sheraton Austin Hotel, Austin, Texas
Dr. Jeff Butterbaugh, FSI International chief technologist and ITRS FEP co-chair, will give an invited presentation entitled “ITRS 2007 Front End Processes – The End of Traditional Transistor Scaling – The Beginning of New Materials and New Structures”
During a short course, held on the first day of the conference, Butterbaugh will be discussing wet cleaning, rinsing and drying, and cryogenic aerosol cleaning in his lecture: “Basic and Advanced Topics of Surface Conditioning and Cleaning Processing for Integrated Circuit Manufacturing.”
In addition, as an Executive Sponsor, FSI will be co-hosting a breakfast roundtable discussion with a small group of IC manufacturing attendees on the future challenges of surface preparation.
Visit the SEMATECH website for more information on the conference.
FSI is very pleased to welcome Leo Xu to FSI as Technical Sales Manager for Greater China and Tam Chan as Technical Sales Manager for Taiwan.
Leo Xu, Technical Sales Manager - China |
Prior to FSI, Leo was with Dainippon Screen and responsible for a broad scope of semiconductor products including wet benches and microlithography tracks. Leo brings to FSI a wealth of knowledge in sales cycle management and marketing, and will apply his experience to supporting FSI China-based customers. He is fluent in English and Japanese, in additional to his native Mandarin. Leo received his bachelor’s of science degree in Material Physics from Fudan University in Shanghai, China. |
|
|
Tam Chan, Technical Sales Manager - Taiwan |
Tam originally joined FSI in 2006 as a senior applications engineer, and is using his engineering background and understanding of FSI products to support FSI customers as technical sales manager for the Taiwan foundry accounts. Prior to FSI, Tam has worked for KoMiCo Technology Taiwan Ltd., Ju Sung Pacific Co. Ltd. and TSMC. Tam has a master’s of science in Chemical Engineering from the University of Massachusetts and a bachelor’s of science in Chemical Engineering from Tamkang University in Taipei, Taiwan. |
Please join us in welcoming Leo and Tam to the FSI family. We are confident that they will become an important resource for our customers and valuable contributors to our company.
OTS (February 2008) -- The U.S. Patent and Trademark Office has awarded FSI a patent for a method which improves rinsing and drying microelectronic devices in immersion tanks for front-end-of-line (FEOL) critical cleans. This patent further strengthens and broadens FSI’s patent portfolio in the area of surface tension gradient (STG®) rinse/dry process and provides IC makers with industry-leading rinse dry performance for 300mm FEOL critical cleaning at 65nm, 45nm, and future generations. The STG® process is currently used in the FSI MAGELLAN® immersion cleaning system.
OTS (February 2008) -- In parallel to the advancements made in ashless resist stripping using ZETA® system ViPR™ process, FSI now offers the HCl free ViPR™ process for metal silicide stripping (see FSI press release “FSI International Announces Breakthrough in Metal Stripping for Silicide Formation”). In collaboration with several customers, FSI has optimized the ViPR™ baseline process for rapid stripping of cobalt and nickel-platinum alloy metals used for salicide formation.
OTS (February 2008) -- “Batch Spray processing for Superior Photoresist Stripping and Film Removal process” was presented at the August 2007 SI China Wafer Cleaning Seminar in Shanghai, China, by James Chu, FSI field application engineering manager for SE Asia and Great China; and at the September 2007, 6th Korean Surface Cleaning Users Group meeting in Seoul, Korea, by Andy Lee, FSI spray applications section manager.
OTS (February 2008) -- FSI presented at the 10th International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing at the October 2007, Electrochemical Society Meeting in Washington, D.C.