OTS (February 2008) -- At the November 2007 China IC Industry Development Conference in Wuxi, China, James Chu, FSI field application engineering manager for SE Asia and Great China presented the “The Financial Benefits of All Wet Photoresist Removal for 200mm.”

This presentation showed 200mm IC manufacturers not only the technical benefits of ash-free photoresist stripping with the FSI ViPR™ process, but also the productivity and cost benefits. Productivity benefits with the ViPR™ photoresist stripping process are achieved through shorter cycle time than traditional ash followed by wet bench processing. Cost benefits are achieved through lower capital cost and lower cleanroom footprint with the FSI ZETA^® system compared to traditional ash followed by wet bench. If you would like more information on this topic, please click here.

The 5th China IC Industry Development Conference was held in association with the 10th Annual Meeting of the IC Branch of CSIA. The conference included presentation by IC industry experts on both business and technology development topics.