OTS (February 2009) -- FSI has been working with the leading IC manufacturers around the world to generate world class innovations using FSI tools and processes. The November 2008 FSI Knowledge Services™ Seminar Series (KSS) in ASIA proved to be the perfect platform for Asia-based IC manufacturers to learn about these latest innovations. Customer and FSI findings were presented to the largest crowd since the seminar series was launched in 2004; nearly 500 customers attended sessions held in Shanghai, Seoul, Singapore, Hsinchu and Taichung.
All of the presentations addressed specific applications of critical importance in the current semiconductor manufacturing environment, such as FSI’s ViPR™ technology for all-wet implanted PR removal and for metal removal for salicide formation, high-k/metal gate processing technologies and achievements on yield gains using FSI cleaning technologies. For example, Magnachip showed how all-wet PR removal with the ViPR technology is enabling a cycle time reduction of 11% compared to ash+wet PR removal. In addition, FSI’s newest technology, the ORION® Single Wafer Cleaning System, was officially unveiled.
The customer-to-customer nature of FSI’s Knowledge Services Seminars ensures the information exchanged provides practical value for the audience. The KSS ASIA 2008 seminar series presentations are available for IC customers on CD and include:
Short Course
- Cleaning Chemistry Compatibility with New IC Device Materials – taught by Dr. Srini Raghavan, Professor of Materials Science and Engineering, University of Arizona
ZETA® Batch Spray Cleaning System
- A Method for Improving the Wet Etching Stability of SOD – Gyuhyun Kim, Hynix
- Advances on 45nm SiGe-Compatible NiPt Salicide Process – Yi-Wei Chen, UMC
- Challenges and Solutions for HKMG Cleaning
- One step ashing and post cleaning performance of ZETA® 200 machine – Jonghyuk Oh, Magnachip Semiconductor
- Selective Metal Stripping for Salicide Formation
- ViPR™ Steam-Injected SPM Process for All-Wet Stripping of Implanted Photoresist
ORION® Single Wafer Cleaning System
- FSI ORION® Single Wafer Cleaning System
- Challenges and Solutions for HKMG Cleaning
- ViPR™ Steam-Injected SPM Process for All-Wet Stripping of Implanted Photoresist
ANTARES® Single Wafer CryoKinetic Cleaning System
- Particle Removal with Cryogenic Aerosols
Other Topics
- FSI Corporate Overview and Product Introduction
- Advanced Surface Preparation for Ge-CMOS Integration – Dr. Sangwoo Lim, Yonsei University
- Drivers for Low Material Loss PR Stripping and Cleaning
- Flash Memory Technology – Current Status and Future Trend – Dr. Yi-Chou Chen, Macronix International
- Microelectronic Technology Overview for Societal and Environment Challenges - Dr. Teng Gao, IMEC
- Prevention of Condensation Defects on Contact Patterns by Improving Rinse and Drying Process – Jungmin Oh, Samsung
CDs of the November 2008 conference presentations are available to FSI customers and may be ordered through the FSI Website.