For several years, FSI has provided full-service customer support operations in Taiwan from its Hsinchu office. Due to the continued growth in Taiwan and the desire to strengthen its customer responsiveness and support offerings, FSI recently opened a new office in Tainan. The Tainan operations include field service and applications engineering and logistical support capabilities.
“By opening this office we can provide more enhanced and efficient support to our customers in Tainan,” said Alan Tai, FSI’s general manager for Southeast Asia and Greater China Region. “The faster we can respond to our customers, the faster they reach their goals. In addition, we want to focus on strengthening our customer relationships to better understand their programs and plans. We also want to assist our customers in exploring and maximizing all the capabilities of FSI products and technologies to fully leverage their tool investments,” added Tai.
The FSI Tainan office is located at No. 589-6, Dashe Village, Sinshih Township, Tainan County 744, Taiwan. Telephone +886-6-5893600, or fax: +886-6-5893700.
FSI is very pleased to welcome James Chu to FSI as field applications engineering department manager for Southeast Asia and Greater China. James’ focus will include leading the FSI field application engineering group to:
- Strengthen field application developed knowledge and to manage this knowledge to enhance customer satisfaction.
- Leverage the regional resources to improve FSI’s customer support responsiveness and flexibility
- Provide business support to proliferate FSI’s cleaning technology solutions through close in-field joint development programs.
James Chu, Field Applications Engineering Manager |
Prior to joining FSI, James was responsible for introducing new lithography technology to Asia for 90nm, 65nm and 45nm semiconductor fabrication process development with ASML Lithography. He is a member of SPIE and has done numerous publications and presentations on nano fabrication technology. James received his master’s degree in engineering science from the National Cheng Kong University in Tainan, Taiwan, and is currently pursuing his PhD degree with a research focus on metrological interpretation of nano scale phenomenon for microelectronics from the same university. Please join us in welcoming James to the FSI family. We are confident that he will become an important resource for our customers and a valuable contributor to our company. |
In April 2007, FSI held yet another successful Knowledge Services™ Seminar Series (KSS) in Asia. Over 350 IC makers attended our KSS sessions in Seoul, Singapore, Beijing, Shanghai, Hsinchu and Tainan.
FSI customers continue to tell us this is a day very well spent. Not only did attendees learn about the broad capabilities of FSI technology solutions, but they gained perspective on industry trends, peer-company challenges and solutions, while enjoying a technical short course from leading industry professors.
During KSS Asia we surveyed the audience to identify their primary cleaning challenges. We thought you might be interested in what made the Top 10 list:
1. Defectivity
2. Wet PR Stripping
3. Selective Etching
4. Material Loss
5. Damage-free
6. Watermarks
7. Cu/Low-k
8. Advanced Nodes
9. Metal Stripping and Cleaning
10. Megasonic Damage
By requesting a CD of the April 2007 Asia KSS Seminar Series, you will find the FSI solutions for these challenges. To order a CD, please click here to submit your request.
April 2007 Seminar Proceeding Include:
The Fundamentals of Particle Adhesion and Removal: This short course, taught by, Dr. Srini Raghavan, Professor of Materials Science and Engineering, University of Arizona and Dr. Stephen Beaudion, Professor of Chemical Engineering, Purdue University, reviews the state of the art:
- Forces that control particle adhesion to surfaces in different media.
- Effects of the particle (size, shape, roughness, composition and position), substrate (roughness and composition), and intervening medium (composition) on the resulting adhesion force.
- Which forces dominate the adhesion interaction at different conditions.
- Particle deformation at equilibrium and interactions between nondeformable particles and substrates.
ANTARES® CryoKinetic System:
- “FSI ANTARES® CryoKinetic Cleaning System Product Overview”
- “FSI ANTARES® CryoKinetic Cleaning - Applications for 90nm and Beyond” – Ling Tze Tan, Chartered
- “Interconnect Yield Enhancement with the Cryogenic Aerosol Process”
MAGELLAN® Immersion Cleaning System:
- “FSI MAGELLAN® Immersion Cleaning System Product Overview”
- “Achieving Ultra-Low Defectivity in Immersion Processing”
ZETA® Spray Cleaning System:
- “FSI ZETA® Spray Cleaning System Product Overview”
- “All Wet PR Strip Process with High Temperature SPM Technology” – Kwang Wook Lee, Samsung
- “All-Wet Stripping of Implanted Photoresist”
- “Applications of Batch Spray Processing for Ni Selective Etch for Salicide Formation” – Steven Piao, SMIC
- “Metal Stripping for NiPt Salicide Formation”
- “ZETA® System Enhancements for All-Wet Photoresist Stripping”
Other Topics:
- “Challenges and Solutions in Surface Preparation”
- "A Study of PR Strip Method induced Bit Line Contact Resistance Variation” – Gyu Hyun Kim, Hynix
- “Contaminant Particle Control for 45nm-level Process and Beyond” – Taesung Kim, Sung Kyun Kwan University
- “The State of the Semiconductor Industry” – Philip Koh, Gartner-Dataquest
- “Wet Process Challenges for CMOS Foundry” – Minhwa Chi, SMIC
OTS (July 2007) -- At the April FSI Knowledge Services Seminar™ Series in Singapore and Shanghai, China, Ms. Ling Tze Tan of Chartered Semiconductor Manufacturing described applications of the ANTARES® cryokinetic aerosol cleaning tool in 90nm BEOL production. Her presentation focused on cleaning after via etch and after dielectric film deposition reflecting a growing widespread concern in the industry about the potential for water and chemical damage to copper and porous dielectrics.
OTS (July 2007) -- The first MAGELLAN® immersion cleaning system on the new high throughput platform has been shipped for use in several production applications at a major logic and memory manufacturer in the US. The MAGELLAN® system has seen widespread acceptance, with the number of installed systems doubling in the last two years. Currently tools are installed in all three major manufacturing regions, Asia, Europe and North America, in both logic and memory fabrication, and in 65nm production and 45nm development applications.
OTS (July 2007) -- At the April FSI Knowledge Services™ Seminar held in Seoul, Korea, Mr. Kwang Wook Lee of Samsung Electronics presented the results of a year-long joint development project to evaluate and improve the performance of FSI’s ViPR™ all wet stripping process on photoresist used in high dose implant processes. The JDP focused on plasma doping applications and successfully qualified the ViPR™ process for increased stripping capability, reduced material loss, and better electrical characteristics.