In April 2007, FSI held yet another successful Knowledge Services™ Seminar Series (KSS) in Asia. Over 350 IC makers attended our KSS sessions in Seoul, Singapore, Beijing, Shanghai, Hsinchu and Tainan.

FSI customers continue to tell us this is a day very well spent. Not only did attendees learn about the broad capabilities of FSI technology solutions, but they gained perspective on industry trends, peer-company challenges and solutions, while enjoying a technical short course from leading industry professors.

During KSS Asia we surveyed the audience to identify their primary cleaning challenges. We thought you might be interested in what made the Top 10 list:
1. Defectivity
2. Wet PR Stripping
3. Selective Etching
4. Material Loss
5. Damage-free
6. Watermarks
7. Cu/Low-k
8. Advanced Nodes
9. Metal Stripping and Cleaning
10. Megasonic Damage

By requesting a CD of the April 2007 Asia KSS Seminar Series, you will find the FSI solutions for these challenges. To order a CD, please click here to submit your request.

April 2007 Seminar Proceeding Include:

The Fundamentals of Particle Adhesion and Removal: This short course, taught by, Dr. Srini Raghavan, Professor of Materials Science and Engineering, University of Arizona and Dr. Stephen Beaudion, Professor of Chemical Engineering, Purdue University, reviews the state of the art:

• • Forces that control particle adhesion to surfaces in different media.
  • Effects of the particle (size, shape, roughness, composition and position), substrate (roughness and composition), and intervening medium (composition) on the resulting adhesion force.
  • Which forces dominate the adhesion interaction at different conditions.
  • Particle deformation at equilibrium and interactions between nondeformable particles and substrates.

ANTARES^® CryoKinetic System:

• • “FSI ANTARES^® CryoKinetic Cleaning System Product Overview”
  • “FSI ANTARES^® CryoKinetic Cleaning - Applications for 90nm and Beyond” – Ling Tze Tan, Chartered
  • “Interconnect Yield Enhancement with the Cryogenic Aerosol Process”

MAGELLAN^® Immersion Cleaning System:

• • “FSI MAGELLAN^® Immersion Cleaning System Product Overview”
  • “Achieving Ultra-Low Defectivity in Immersion Processing”

ZETA^® Spray Cleaning System:

• • “FSI ZETA^® Spray Cleaning System Product Overview”
  • “All Wet PR Strip Process with High Temperature SPM Technology” – Kwang Wook Lee, Samsung
  • “All-Wet Stripping of Implanted Photoresist”
  • “Applications of Batch Spray Processing for Ni Selective Etch for Salicide Formation” – Steven Piao, SMIC
  • “Metal Stripping for NiPt Salicide Formation”
  • “ZETA^® System Upgrades for All-Wet Photoresist Stripping”

Other Topics:

• • “Challenges and Solutions in Surface Preparation”
  • "A Study of PR Strip Method induced Bit Line Contact Resistance Variation” – Gyu Hyun Kim, Hynix
  • “Contaminant Particle Control for 45nm-level Process and Beyond” – Taesung Kim, Sung Kyun Kwan University
  • “The State of the Semiconductor Industry” – Philip Koh, Gartner-Dataquest
  • “Wet Process Challenges for CMOS Foundry” – Minhwa Chi, SMIC