In October FSI held another successful Knowledge Services Seminar Series in Grenoble, Dresden and Tel Aviv. We’re very pleased to have brought this event to Israel for the first time.
Since the 2004 launch of FSI’s Knowledge Services Seminar Series, over 1150 IC manufacturing professionals throughout Asia, Europe and the US have participated in these very informative seminars.
The day-long sessions consisted of a morning short course, taught by Dr. Stephen P. Beaudoin, Professor of Chemical Engineering, Purdue University and by Dr. Jeff Butterbaugh, FSI Chief Technologist. The course, Fundamentals of Particle Adhesion and Removal, reviewed the state of the art in understanding the forces that control particle adhesion to surfaces in different media.
The afternoon kicked off with engaging customer and analyst keynote speeches looking at industry and technology drivers, followed by a series of presentations on surface preparation focusing on:
- Current cleaning technologies extendable to meet challenges down to 22nm
- All-wet PR strip with the ZETA® Batch Spray Cleaning System ViPR™ process
- Highly selective nitride etching and low defectivity with the MAGELLAN® Immersion Cleaning System
- Post in-line probe cleaning with the ANTARES® CyroKinetic Cleaning System.
- Wafer bonding for SOI
- Nanocrystal formation for advanced Flash Memory fabrication
- Advanced metal stripping for salicide formation
EMEA October 2006 Seminar Proceeding:
SHORT COURSE: The Fundamentals of Particle Adhesion and Removal:
- Course summary: Understanding of the effects of the particle (size, shape, roughness, composition and position), substrate (roughness and composition), and intervening medium (composition) on the resulting adhesion force. Which forces dominate the adhesion interaction under different conditions, particle deformation at equilibrium, and interactions between non-deformable particles and substrates.
FSI ANTARES® CryoKinetic Cleaning System Papers:
- ANTARES® CryoKinetic Cleaning System Product Overview
- ANTARES® System – AMD Evaluation – Vivien Schroeder and Val Parks, AMD
- Post In-line Probe Particle Removal and Yield Recovery with Cryogenic Aerosol
FSI MAGELLAN® Immersion Cleaning System Papers:
- MAGELLAN® Immersion Cleaning System Product Overview
- Molecular bonding for substrates: elaboration and circuit transfer – written by Nelly Kernevez and presented by Marek Kostrzewa, LETI.
- Silicon nanocrystals for non volatile memories: Surface preparation challenges – Joel Dufourcq, Atmel
- Achieving Ultra-Low Defectivity in Immersion Cleaning
- Precision Etching With Chemical Inject
- Advanced Silicon Nitride Wet Etching Processes and Applications
FSI ZETA® Spray Cleaning System Papers:
- ZETA® Spray Cleaning System Product Overview
- Advanced Cobalt Stripping Process for High Yield Salicide Formation – Eran Veler-Poleg, Tower Semiconductor
- Ni/NiPt Stripping and Contact Cleaning
- All-Wet Stripping of Implanted Photoresist
OTHER TOPICS:
- Damage-Free Processing of Advanced Multiple-Gate FETs
- Challenges and Solutions in Surface Preparation
- Advanced SOI and Engineered Materials – Ionut Radu, Soitec
- Novel Ultra-Fast Wet Electrochemical Etching of Silicon -- Professor Yair Ein-Eli, The Technion
- “Semiconductor Forecast - Applications Lead to Opportunities” - Joanne Itow, Semico
Hold the Date for the next FSI Knowledge Services™ Seminars in Asia:
- April 10, 2007 - Seoul
- April 13, 2007 - Singapore
- April 17, 2007 - Shanghai
- April 19, 2007 - Hsinchu
To view more information on the FSI Knowledge Services™ Seminar Series, click here.