FSI was a Proud Sponsor of the 5th Semiconductor International China Wafer Cleaning Seminar Held 15 October 2008 in Shanghai
OTS (September 2008) -- The The SI China conference theme was Applications and Challenges in Cleaning Technology at the Age of Deep Submicron and emphasized practical and next-generation technologies, including:
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- Process control in FEOL cleaning, including wafer cleaning after gate etching, resist strip/ashing;
- Process control in BEOL cleaning, including wafer cleaning in metal layer, interconnect layer and bumping processes;
- Control and reduction of cleaning defect rate;
- Development and application of new cleaning materials;
- The impact of new material (low k/ high k, etc.) and new device structure on cleaning and its solution.
James Chu (Ming Mao), FSI International field applications engineering manager for Southeast Asia and Greater China, presented “Steam-Injected SPM Process for All-Wet Stripping of Implanted Photoresist.”
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