OTS (September 2008) -- Apprecia Technology, Inc. presents at the Electronic Journal 186th Technical Symposium - Exhaustive Study for 2008 ULSI Surface Cleaning and Drying Technology - in Tokyo, August 28, 2008
Electronic Journal in Japan sponsors many technical symposia. Each year one of the symposia is focused on cleaning technology in IC manufacturing. In 2008, the focus of this symposium was on cleaning challenges for 45nm and 32nm technology generations.
At this year’s meeting, held at the Kokuyo Hall in Shinagawa, Tokyo on August 28, 2008, Apprecia Technology, Inc., FSI’s partner and distributor in Japan, presented “Advanced Surface Cleaning Technology Required for Beyond 32nm Device Generation.” This paper was presented by Kenji Shibata, Apprecia Technology Senior Director. Mr. Shibata’s presentation described some of the 32nm cleaning challenges and FSI solutions to meet those challenges such as FSI’s ViPR™ Technology for both implanted photoresist stripping and metal stripping for salicide formation as well as FSI’s CryoKinetic Technology for chemical-free, all-dry particle removal.
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