MINNEAPOLIS (May 13, 2008) -- FSI International, Inc. (Nasdaq: FSII), a leading manufacturer of wafer cleaning systems used in the fabrication of integrated circuits, announced today that it shipped its single wafer wet cleaning technology to a major semiconductor manufacturer for the development of back-end-of-line (BEOL) cleaning capability for 32nm IC manufacturing. After a thorough review of competitive alternatives, this customer determined that FSI’s technology best met its anticipated new requirements for 32nm device manufacturing. For the development program, FSI has shipped an evaluation ORION™ Single Wafer Cleaning System.
IC manufactures are finding low-k materials and the metal film stacks used for 32nm devices are much more sensitive to wet cleaning than previous generations of BEOL processes. FSI’s differentiated single wafer technology demonstrated highly efficient removal of etch and ash byproducts without altering the dielectric, changing etching metal film thickness and avoiding galvanic corrosion.
“It is indeed gratifying and affirming to be selected by this premier customer,” said Don Mitchell, FSI chairman and CEO. “We have taken a very deliberate approach in the development of our single wafer cleaning technology, focusing on translating our considerable experience and expertise into a tool that will meet the industry’s advancing requirements. Our unique history, with decades of experience in batch and single wafer platforms for immersion, spray and aerosol surface conditioning, gives us an intimate understanding of the range of cleaning needs. Drawing heavily on this invaluable asset, our single wafer cleaning technology implements certain core technologies from well-established products, while selectively innovating to solve challenges specific to 32nm processes,” continued Mitchell.
FSI International, Inc. is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the Company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. For more information, please visit FSI’s website at http://www.fsi-intl.com.