Short Course: Cleaning Chemistry Compatibility with New IC Device Materials taught by Professor Srini Raghavan, Professor of Materials Science and Engineering, University of Arizona
10:40 to 11:00
Refreshment Break
Session II
Technical Seminar Surface Conditioning Industry Drivers, Challenges and Solutions
11:00 to 11:30
FSI Corporate and Product Overview - FSI International
11:30 to 12:00
Drivers for Low Silicon Loss PR Stripping and Cleaning - FSI International
12:00 to 12:20
Steam-Injected SPM for High Performance Ash-Free All Wet Photoresist Stripping - FSI Inernational
12:20
to 13:50
Lunch
and Afternoon Registration
13:50 - 14:00
Evolution of Salicide - FSI International
14:00 - 14:20
NiPt Stripping for Salicide Formation - STMicroelectronics
14:20 - 14:40
FSI Single Wafer Cleaning System Overview - FSI International
14:40 - 15:10
Cu/low-k Challenges and Cleaning Process Development for 32nm/22nm Logic Technology - LETI
15:10 - 15:30
Cryogenic Aerosol Processes for Yield Enhancement - FSI International
15:30 - 15:50
Refreshment Break
15:50 - 16:10
Report on 3D Interconnect and Metal Wafer Bonding - LETI
16:10 - 16:30
Impact of Drying on Bonding - LETI
16:30 - 16:50
ZETA® System for In-House Wafer Reclaim - FSI International