FSI will be holding its next Knowledge Services™ Seminar Series in the following locations and on dates:

• 13 May in Tel Aviv, Israel at Bruno in the Azrieli center
• 15 May in Milan, Italy at the Villa Trivulzio
• 20 May Grenoble, France at the Château de Sassenage
• 22 May Dresden, Germany at the MARITIM Hotel & Congress Center

The EUROPE Middle East Area (EMEA) FSI Knowledge Services™ 2008 Seminar Series Daily Agenda:

Short Course: Session I
“Cleaning Chemistry Compatibility with New IC Device Materials”

Professor Srini Raghavan will begin with a brief overview of wafer cleaning objectives and standard cleaning technologies and then focus on the introduction of new materials into IC devices. Professor Raghavan will discuss how standard cleaning technologies need to be adjusted and re-optimized to accommodate these new materials. New material topics will include: high mobility channel materials, high-k gate dielectrics, metal gates, SiGe, porous low-k, self-aligned copper barrier and chalcogenide materials.

Click here to learn more abut Dr. Srini Raghavan, Professor of Materials Science and Engineering, University of Arizona

FSI Knowledge Services™ Technical Seminar: Session II
“Surface Conditioning Industry Drivers, Challenges and Solutions”

Technical Presentations by FSI and IC Manufacturers on:

• All Wet Photoresist Removal
• Metal Stripping for Salicide Formation
• Particle Removal with Cryogenic aerosol
• Cleaning of Cu/Low-K Dual Damascene
• Advanced Immersion Processes
• Wafer Reclaim

The day also includes opportunities during breaks and lunch to network with your peers and other IC makers. And of course, a few "Lucky Draws" held throughout the day.