Short Course: Cleaning Chemistry Compatibility with New IC Device Materials taught by Professor Srini Raghavan, Professor of Materials Science and Engineering, University of Arizona
10:40 to 11:00
Refreshment Break
Session II
Technical Seminar Surface Conditioning Industry Drivers, Challenges and Solutions
11:00 to 11:20
FSI Corporate and Product Overview - FSI International
11:20 to 12:05
Trends and Cleaning Challenges in Non-Volatile Memory Technology - Numonyx
12:05 to 12:30
Steam-Injected SPM for High Performance Ash-Free All Wet Photoresist Stripping - FSI Inernational
Evaluation of the ZETA® System ViPR™ Process for All-Wet PR Strip in 200mm Manufacturing - Tower Semiconductor
12:30
to 13:50
Lunch
and Afternoon Registration
13:50 - 14:00
Evolution of Salicide - FSI International
14:00 - 14:20
Optimization of SPM-SC1 Based Cobalt Salicide Selective Etching - Numonyx
14:20 - 14:40
FSI Single Wafer Cleaning System Overview - FSI International
14:40 - 15:10
Cu/low-k Challenges and Cleaning Process Development for 32nm/22nm Logic Technology - FSI International
15:10 - 15:30
Cryogenic Aerosol Processes for Yield Enhancement - FSI International
15:30 - 15:50
Refreshment Break
15:50 - 16:10
Influence of dry ashing and wet treatments on NVM metal gate structures - Numonyx
16:10 - 16:30
Yield Improvement Using the MAGELLAN System Flexibility to Achieve Recipe Optimization - Numonyx
16:30 - 16:50
ZETA® System for In-House Wafer Reclaim - FSI International