FSI International (ticker: FSII,
exchange: NASDAQ) News Release - 12/2/03
---------------------------------------------------------------------------------------
Leading Japanese IC Manufacturer Orders ANTARES
System after Demonstrating Substantial Yield Improvements in an
On-Site Evaluation
MINNEAPOLIS--(BUSINESS WIRE)--Dec. 2, 2003--FSI International,
Inc. (Nasdaq:FSII) today announced that a leading Japanese IC
manufacturer has purchased a multi-chamber ANTARES(R) CX Advanced
Cleaning System with AspectClean(TM) after experiencing significant
yield increases during several process application steps in an
on-site evaluation. The system will be used in 130-nm production
for front-end-of-line (FEOL) and back-end-of-line (BEOL) defect
removal on planar and patterned structures.
"FSI's ANTARES CryoKinetic technology has demonstrated its
superiority over even the most advanced traditional particle removal
methods and is poised to take over the defect reduction market,"
said Don Mitchell, FSI International chairman and CEO. "ANTARES
technology is an excellent replacement for traditional scrubber
technology because it can address current and future advanced
device manufacturing requirements without causing damage to sensitive
patterned structures. This technology increases yield, reduces
device ramp time and provides customers with an outstanding return
on investment."
Utilizing FSI's AspectClean process for defect removal on the
ANTARES System, the customer demonstrated normalized device yield
increases compared with reference values ranging from up to 5
percent on 180-nm to over 10 percent on 130-nm technology wafers.
These normalized yield improvements were attained by inserting
this process at numerous FEOL and BEOL points for post-etch, post-deposition
and post-CMP applications. Results were presented in November
at the First International Surface Cleaning Workshop at Northeastern
University in Boston, Mass.
"ANTARES CryoKinetic technology is already being used in
production by several large IC manufacturers throughout the U.S.
and Europe," Mr. Mitchell said. "With the sale of this
tool, the ANTARES system has now expanded into the Japanese market
as well. We expect to see significant continued interest in this
technology all over the world."
The ANTARES System is a fully automated, single-wafer, CryoKinetic
system for 300-mm and 200-mm wafers with a field-proven history
of removing surface particle defects and improving customer yields.
The AspectClean process, which was introduced in September 2003,
provides the defect reduction capability necessary to allow users
to use the ANTARES system for advanced processes. The ANTARES
System provides an all-dry, nonreactive method of removing defects
from FEOL and BEOL planar and patterned structures, including
low-k structures, without damage and without altering the k value
or physically damaging the interconnect, which delivers a clear
advantage over traditional methods.
FSI International Inc. is a global supplier of surface conditioning
equipment technology and support services for microelectronics
manufacturing. Using the Company's broad portfolio of cleaning
products, which include batch and single-wafer platforms for immersion,
spray, vapor and CryoKinetic technologies, customers are able
to achieve their process performance, flexibility and productivity
goals.
The Company's support services programs provide product and process
enhancements to extend the life of installed FSI equipment, enabling
worldwide customers to realize a higher return on their capital
investment.
FSI maintains a Web site at http://www.fsi-intl.com.
CONTACT: FSI International, Inc., Minneapolis Trade Media: Laurie
Walker, 952-448-8066 or Financial Media and Investors: Benno Sand,
952-448-8936 SOURCE: FSI International, Inc.
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