FSI
International (ticker: FSII,
exchange: NASDAQ) News Release
- 1/23/03
---------------------------------------------------------------------------------------
FSI Receives Patent for New Immersion Cleaning
Method
Combination of Wet Etching and Cleaning with Surface Tension
Gradient Rinsing and Drying Produces Ultra-Clean Semiconductor
Surfaces
MINNEAPOLIS (January 23, 2003)—FSI International
Inc. (Nasdaq: FSII) today announced that it has been awarded
U.S. Patent No.
6,491,043, which covers a method for wafer cleaning that combines
FSI’s proprietary Surface Tension Gradient (STG®)
rinse/dry technology with a wet etching step. This patent further
strengthens FSI’s family of 13 patents that claim priority
from FSI’s original patent application on November 14,
1994. This family of patents covers advanced and unique approaches
to immersion cleaning technology, available with the FSI MAGELLAN™ 300 STG® Immersion Clean System.
“Our family of patents related to Surface Tension Gradient rinsing and
drying covers many aspects of how this technology is used to enhance the performance
of immersion cleaning systems,” said Jeff Butterbaugh, surface conditioning
chief technologist at FSI. “Combining wet etching operations with our
superior rinsing and drying technology sets the benchmark for next-generation
immersion systems and allows us to offer better process performance, a smaller
footprint and a reduction in cycle time.”
An application of this technology is made in the FSI MAGELLAN
Immersion Clean System where wafers can either be transferred
from an etch tank directly
to an STG Rinse/Dry tank or where wafers can be etched in the STG Rinse/Dry
tank
before transitioning to the final rinse/dry. FSI has several additional
patents pending for further improvements of this technology.
“We remain committed to our R&D efforts and technological advancements.
FSI has been granted 75 U.S. patents in the areas of immersion, spray
and gas-phase surface conditioning technology and applications know-how. As
a
result, the continued strength of our intellectual
property contributes to a strong product portfolio and proven
customer solutions,” said John Ely, president of the
Surface Conditioning Division at FSI.
The MAGELLAN™ 300 STG® Immersion Clean System is designed
to address the challenges of 300-mm manufacturing at 100-nm
and below technology nodes. The innovative system offers short
cycle time, versatility and high process performance in a footprint
up to 40 percent smaller than the competition. Conventional
concentrated chemistries, as well as advanced dilute, ozone
and gas-to-chemical chemistries, can be used in the system.
FSI International Inc., a global supplier of wafer cleaning
and resist processing equipment and technology, delivers economic
and technical advantages for current and emerging microelectronics
manufacturing challenges. Using the company's broad portfolio
of products, which include immersion, spray, vapor and CryoKinetic
systems for wafer cleaning, and resist processing systems for
wafer coating and developing, customers are able to efficiently
achieve their goals. FSI’s customers include microelectronics
manufacturers located throughout North America, Europe, Japan
and the Asia-Pacific region.
FSI is a 2002 recipient of the VLSI Research 10 BEST Award.
In seven of the last ten years, FSI has been recognized for
its superior customer satisfaction in the category of Small
Suppliers of Wafer Processing Equipment.
FSI maintains a Web site at http://www.fsi-intl.com.
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