FSI
International (ticker: FSII,
exchange: NASDAQ) News Release
- 7/9/03
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FSI International Introduces FlashClean™ Advantage
for Industry-Leading Productivity and Performance
Package provides benefits on the world’s
number one batch spray processor
MINNEAPOLIS (July 9, 2003) -- FSI International, Inc. (Nasdaq:
FSII) today introduced the new FlashClean™ Advantage package
for use on its ZETA® Surface Conditioning Systems. The FlashClean
Advantage package consists of hardware, software and process
advancements, which further enhance the ZETA System’s
productivity and performance. Field upgrades are available for
the currently installed base of ZETA Systems.
The ZETA System with FlashClean Advantage provides users with
substantial productivity benefits through shortened process
time and increased throughput.
The cycle time reduction benefits all ZETA System applications. In back-end-of-line
(BEOL) post-ash clean, the ZETA System with FlashClean Advantage offers a
cycle time that is up to 30 percent shorter than competing batch spray systems,
and up to 15 percent faster than competing single wafer wet processors. The
system also provides excellent particle performance down to 60-nm, resulting
in superior die yield.
“In today’s fiercely competitive environment, IC manufacturers must improve
their bottom line. Increasing yield and enhancing productivity in surface
conditioning processes, through technology such as our ZETA System with FlashClean
Advantage, are two key ways to accomplish this goal,” said Don Mitchell,
chairman and CEO of FSI International. “FSI is focused on continuously
finding new ways to improve our technology platforms to ensure that we maintain
our position as the market share leader in batch spray products.”
FSI’s ZETA Surface Conditioning System includes fully
automated configurations for 200-mm and 300-mm wafer sizes and
semi-automated configurations for 200-mm
and 150-mm wafer sizes. Designed for front-end-of-line (FEOL) and BEOL cleaning
processes at technology nodes of 130-nm and below, the ZETA System is proven
for a wide range of applications,
including FEOL resist strip and post-ash clean, BEOL post-ash
clean, salicide strip, C4 cleans and wafer reclaim. The system
uses centrifugal spray technology; wafers undergo dry-in,
dry-out processing in a closed, nitrogen-purged chamber. FSI's
versatile chemical delivery technology prepares the chemicals
at controlled composition and temperature and delivers them
directly onto the wafers.
FSI International Inc. is a global supplier of surface conditioning
equipment technology and support services for microelectronics
manufacturing. Using the Company’s broad portfolio of
cleaning products, which include batch and single-wafer platforms
for immersion, spray vapor and CryoKinetic technologies, customers
are able to achieve their process performance, flexibility and
productivity goals.
The Company’s support services programs provide product
and process enhancements to extend the life of installed FSI
equipment enabling worldwide customers to realize a higher return
on their capital investment.
FSI maintains a Web site at http://www.fsi-intl.com.
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