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FSI
International (ticker: FSII,
exchange: NASDAQ) News Release
- 6/26/03
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FSI International to Broadcast July Process
Outlook Forum Seminar on the Impact of IC Interconnects on Semiconductor
Industry
MINNEAPOLIS (June 26, 2003) -- FSI International, Inc. (Nasdaq:
FSII) today announced that the July Process Outlook Forum™ series
will broadcast the keynote presentation from FSI’s 3rd
Annual Surface Conditioning Process Symposium, being held July
9-11, 2003, in Chaska, Minn. On July 9th, at 10:00 a.m. (CDT),
Dr. Kenneth A. Monnig, interconnects program associate director,
International SEMATECH, will give the keynote presentation on
the impact of challenges in integrated circuit interconnects
on the semiconductor industry.
The keynote address will be available to the public via the
Process Outlook Forum, a monthly, web-based seminar series sponsored
by FSI International and Solid State Technology. Registered
users may participate live through a teleconference, or may
access the presentation archive later at anytime to download
the presentation and the audio recording in MP3. Registration
for the Process Outlook Forum is free at http://www.fsi-intl.com/forum.
The Process Outlook Forum, which was launched in March 2003,
is designed to provide value to engineers, researchers and others
in the semiconductor industry by addressing a variety of issues
pertaining to IC process technology challenges, from process
tool development to the future of IC manufacturing.
“There is an incredible amount of information presented and exchanged
during our Surface Conditioning Process Symposium, and this
year the keynote address will be available publicly to registered
users of our Process Outlook Forum. Hosting a symposium that
involves our customers and suppliers enables us to synergize
our roadmaps and provide customers with complete, end-to-end
surface conditioning solutions,” commented Scott Becker,
corporate vice president of marketing.
The Surface Conditioning Process Symposium is held annually
to share and exchange process data and system information
between the engineering communities of FSI and its customers
and downstream suppliers, including materials suppliers and
industry consortia. Attendees will discuss new applications,
capabilities and products; identify issues and problems; and
provide input into the FSI Technology Roadmap and strategic
planning process. The meeting is non-confidential, but is
restricted to FSI’s customers, partners and affiliates.
This year’s symposium topics will address surface conditioning
issues related to the implementation of high-k and copper/low-k,
the development of 90nm solutions, such as megasonics-free
and etch-free critical clean, and cleaning for specialty markets,
such as MEMS.
FSI International Inc., a global supplier of surface conditioning
equipment technology and support services for microelectronics
manufacturing. Using the Company’s broad portfolio of
cleaning products, which include batch and single-wafer platforms
for immersion, spray vapor and CryoKinetic technologies, customers
are able to achieve their process performance, flexibility and
productivity goals.
The Company’s support services programs provide product
and process enhancements to extend the life of installed FSI
equipment enabling worldwide customers to realize a higher return
on their capital investment.
FSI maintains a Web site at http://www.fsi-intl.com.
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