FSI
International (ticker: FSII,
exchange: NASDAQ) News Release
- 3/25/03
---------------------------------------------------------------------------------------
FSI International Receives Follow-on Order
From Leading 300-mm Semiconductor Manufacturer
Surface Conditioning Systems will be Installed in
European R&D Facility
MINNEAPOLIS (March 25, 2003) -- FSI International Inc. (Nasdaq:
FSII) today announced that it has received follow-on orders
for ZETA® 300 Surface Conditioning Systems from a leading global
semiconductor manufacturer. The 300-mm tools will be installed
at a European R&D facility formed through a multi-company
development program, which currently has multiple ZETA 300 Systems
installed. The ZETA 300 systems will be used for front-end-of-line
(FEOL) and back-end-of-line (BEOL) wafer cleaning processes.
“This request for additional ZETA 300-mm tools reflects the ongoing success
that this customer has experienced with its existing FSI systems, as well as
the ZETA system’s ability to continue delivering value through decreasing
technology nodes. As part of the development program, this customer is focused
on cultivating and building 90-nm to 32-nm chip technologies over the next five
years. By playing a part in these efforts, FSI is demonstrating the robust and
flexible nature of our systems and our commitment to the progression of technology,” said
John Ely, president of FSI’s Surface Conditioning Division and corporate
vice president. “The work done through this alliance will have a strong
impact on both the IC manufacturing industry and the future growth of the member
companies.”
The ZETA 300-mm Surface Conditioning System is designed for
batch spray FEOL and BEOL cleaning processes at technology
nodes of 130-nm and below. The
system uses centrifugal spray technology; wafers undergo dry-in, dry-out
processing in a closed, nitrogen-purged chamber. FSI's versatile
chemical delivery
technology
prepares the chemicals at controlled composition and temperature, and
delivers them directly onto the wafers. The ZETA System
is proven for a wide range
of applications, including FEOL resist strip and post-ash clean, BEOL
post-ash clean, salicide strip, C4 clean and wafer reclaim.
FSI International Inc., a global supplier of surface conditioning
equipment and technology, delivers economic and technical
advantages for current and emerging microelectronics manufacturing
challenges. Using the company's broad portfolio of products,
which include immersion, spray, vapor and CryoKinetic systems
for wafer cleaning, customers are able to efficiently achieve
their goals. FSI’s customers include microelectronics
manufacturers located throughout North America, Europe, Japan
and the Asia-Pacific region.
FSI is a 2002 recipient of the VLSI Research 10 BEST Award.
In seven of the last ten years, FSI has been recognized for
its superior customer satisfaction in the category of Small
Suppliers of Wafer Processing Equipment.
FSI maintains a Web site at http://www.fsi-intl.com.
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