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FSI
International (ticker: FSII,
exchange: NASDAQ) News Release
- 3/31/03
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FSI International and Solid State Technology
Announce the Launch of Process Outlook Forum™ Seminar Series
MINNEAPOLIS (March 31, 2003) -- FSI International Inc. (Nasdaq:
FSII) and Solid State Technology, a PennWell publication, today
announced the inauguration of the Process Outlook Forum™ Seminar
Series. The Process Outlook Forum is a monthly, web-based seminar
series open to everyone, but is specifically designed to provide
value to engineers in the semiconductor industry, researchers
and industry watchers. Expert speakers will be invited to address
a variety of issues pertaining to IC process technology challenges,
from process tool development to the future of IC manufacturing.
“Never before have so many technology challenges and transitions converged
at once. In order to find processing solutions to implement these changes in
a timely fashion, and to extend Moore’s Law, the industry’s researchers
and engineers must better leverage external resources,” said Don Mitchell,
chairman and chief executive officer of FSI. “The Process Outlook Forum,
with its user-friendly format, will address the industry’s tough economic
and technological challenges by providing open discourse and unprecedented access
to information, helping participants adapt to the ongoing changes.”
The first seminar, being held on April 15, will feature Dr.
Robert Guernsey, distinguished engineer and director of silicon
technology strategy for IBM
Microelectronics, as the keynote speaker. He will address the topic of “Upcoming Technology
Challenges for IC Manufacturing.” Dr. Walter Class, fellow and strategic
marketing manager at Axcelis, will speak at the May 20 seminar on “Scaling
Problems Confronting Front-end Processing.” Dr. Jeffery Butterbaugh, fellow
and Surface Conditioning chief technologist for FSI, will speak on “Surface
Preparation Challenges for 90nm and Beyond” at the June 17 seminar.
“
New materials, thinner films and narrower process windows are creating challenges
in every step of the semiconductor fabrication process flow. Improving yields
and yield ramps simultaneously requires far more automatic process control in
advanced fabs. An exploration of these challenges, with an exchange of ideas
and potential solutions by practitioners and process developers, is clearly
needed, and the web offers an opportunity to accomplish this efficiently. Our
joint efforts with FSI are providing a timely interchange to address these needs,” commented
David Barach, publisher of Solid State Technology.
Each seminar is comprised of a 30-minute presentation, followed
by a 15-minute question and
answer period. Participants can download the presentation from
the web and then listen to the seminar through a bridging
conference call. The seminar recording will be available for
a limited time after the presentation to accommodate those
who cannot attend the live discussion. To register, please
visit www.fsi-intl.com/forum.
Solid State Technology serves engineers and engineering managers
all over the globe in semiconductor/thin film manufacturing,
with in-depth, technical authoritative information on the latest
advances in processes and materials for fabrication of integrated
circuits, discretes and other thin-film devices. Solid State
Technology also covers metrology, robotics/automation/wafer
handling, fab software, yield improvement, contamination control,
vacuum technology, and other allied technologies for semiconductor/thin-film
processing plants, as well as fab management topics. For more
information, visit www.solid-state.com.
Founded in 1910, PennWell Corporation is a highly diversified
media company providing authoritative print and online publications,
conferences and exhibitions, research, databases, internet-based
services and other information products to strategic global
markets, including electronics, semiconductor manufacturing,
communications, lasers, optoelectronics, computer graphics,
oil and gas, electric power, fire services, dental, and water
and wastewater. In addition to PennWell's headquarters in Tulsa,
Oklahoma and its Advanced Technology Division based in Nashua,
New Hampshire, PennWell has offices in Houston, Texas; Seattle,
Washington; Providence, Rhode Island; Campbell, California;
Fairlawn, New Jersey; London, England; and Schwabisch, Germany.
FSI International Inc., a global supplier of surface conditioning
equipment and technology, delivers economic and technical advantages
for current and emerging microelectronics manufacturing challenges.
Using the company's broad portfolio of products, which include
immersion, spray, vapor and CryoKinetic systems for wafer cleaning,
customers are able to efficiently achieve their goals. FSI’s
customers include microelectronics manufacturers located throughout
North America, Europe, Japan and the Asia-Pacific region.
FSI is a 2002 recipient of the VLSI Research 10 BEST Award.
In seven of the last ten years, FSI has been recognized for
its superior customer satisfaction in the category of Small
Suppliers of Wafer Processing Equipment.
FSI maintains a Web site at http://www.fsi-intl.com.
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