FSI
International (ticker: FSII,
exchange: NASDAQ) News Release
- 9/15/03
---------------------------------------------------------------------------------------
FSI International Demonstrates a New ANTARES® System
CryoKinetic Process to Address a Major Cleaning Challenge: Removal
of Defects Without Damaging Sensitive Structures
MINNEAPOLIS (September 15, 2003) -- FSI International, Inc.
(Nasdaq: FSII) today announced that, in collaboration with a
leading integrated circuit manufacturer, it has demonstrated
a new CryoKinetic process for removing defects on sensitive
device structures. This new process, known as AspectClean™,
provides customers with a method of removing defects from back-end-of-line
(BEOL) patterned low-k structures that will not alter the k
value or physically damage the structures.
Utilizing the AspectClean process, customers can now apply the
ANTARES® system to advanced device technology where traditional
methods of defect reduction have been phased out due to damage
issues. The new AspectClean soft-cleans using cryogenic aerosols
has demonstrated high removal efficiency on sensitive narrow
low-k structures without causing damage, which is becoming more
critical in 90nm production ramps.
An added benefit of CryoKinetic technology is its all-dry process.
The use of wet processes with today’s hydrophobic advanced
materials can lead to watermark residues, but the CryoKinetic
process is water free and as a result does not leave watermarks.
“The development of this new process further demonstrates the
value and extendibility offered by FSI surface conditioning
systems,” said Don Mitchell, FSI International chairman
and CEO. FSI is focused on providing our customers with flexible,
cost effective and extendable solutions through 90nm and beyond
technology nodes. The ANTARES AspectClean process is a perfect
example, as it is a highly productive process that can increase
yield, while using less consumables and consequently lowers
cost of ownership up to 20 percent.
The ANTARES System, a fully automated, single-wafer, CryoKinetic
system for 300-mm and 200-mm wafers, has a field-proven history
of reducing difficult defects and improving customer yields.
FSI's CryoKinetic processing technology is an all-dry, non-reactive
process that removes particles through impact by high-velocity
cryogenic aerosols, and is ideal for applications on sensitive
films and structures, such as copper/low-k and gate modules.
FSI International Inc. is a global supplier of surface conditioning
equipment technology and support services for microelectronics
manufacturing. Using the Company’s broad portfolio of
cleaning products, which include batch and single-wafer platforms
for immersion, spray vapor and CryoKinetic technologies, customers
are able to achieve their process performance, flexibility and
productivity goals.
The Company’s support services programs provide product
and process enhancements to extend the life of installed FSI
equipment enabling worldwide customers to realize a higher return
on their capital investment.
FSI maintains a Web site at http://www.fsi-intl.com.
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