FSI
International (ticker: FSII,
exchange: NASDAQ) News Release
- 9/15/03
---------------------------------------------------------------------------------------
FlashClean™ Advantage Successfully Implemented
on the ZETA® 300 Surface Conditioning System in a Taiwanese
300-mm Fab Provides Up to 20 Percent Productivity Improvement
MINNEAPOLIS (September 15, 2003) -- FSI International, Inc.
(Nasdaq: FSII) today announced that a ZETA® 300 Spray Cleaning
System upgraded with the FlashClean™ Advantage has successfully
shown productivity and defectivity improvements at the 65-nm
technology node in a 300-mm Taiwanese fab.
The recently released FlashClean Advantage enhances productivity
benefits on the ZETA System through shortened process time,
increased throughput and enables meeting requirements for 65-nm
technology. This system enhancement, field proven for front-end-of-line
(FEOL) film strips and wet etch applications, is now being offered
to the market for back-end-of-line (BEOL) cleaning. The ZETA
System with FlashClean increases productivity by 15-20 percent,
decreases cost of ownership by 10-20 percent and has demonstrated
excellent particle performance down to 65-nm particle size,
contributing to superior die yield.
The FlashClean Advantage package is standard on new ZETA 300
and 200 Surface Conditioning System orders. It is also available
as a field upgrade for already installed ZETA Systems.
“In order to maximize the benefits of new process technologies,
customers demand rapid transition to new technology nodes. We
address this need by providing solutions based on mature, proven
technologies whenever possible. Our approach lengthens the life
of the tool in customer installation and reduces customers’ capital
expenditure needs. Furthermore, it enables the customer to avoid
the potential high risk associated with unproven, novel technologies,” said
Don Mitchell, FSI International chairman and CEO. “Customer
adoption of the FlashClean
Advantage indicates that our target market appreciates our focus
on extendible products. We are gratified to know that a product
we introduced at SEMICON West in July is already demonstrating
results in the field and exceeding customers’ expectations.”
FSI’s ZETA Surface Conditioning System includes fully
automated configurations for 200- and 300-mm wafer sizes and
semi-automated configurations for 200-
and 150-mm wafer sizes. Designed for FEOL and BEOL cleaning processes at technology
nodes of 130-nm and below, the ZETA System is proven for a wide range of applications,
including FEOL resist strip and post-ash clean, BEOL post-ash clean, salicide
strip, C4 cleans and wafer reclaim. The system uses centrifugal spray technology;
wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged chamber.
FSI's versatile chemical delivery technology prepares the chemicals at controlled
composition and temperature and delivers them directly onto the wafers.
FSI International Inc. is a global supplier of surface conditioning
equipment technology and support services for microelectronics
manufacturing. Using
the Company’s broad portfolio of cleaning products, which include
batch and single-wafer platforms for immersion, spray vapor and CryoKinetic
technologies,
customers are able to achieve their process performance, flexibility and
productivity goals.
The Company’s support services programs provide product
and process enhancements to extend the life of installed FSI
equipment enabling worldwide
customers to realize a higher return on their capital investment.
FSI maintains a Web site at http://www.fsi-intl.com.
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