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FSI International (ticker: FSII, exchange: NASDAQ) News Release - 12/21/04
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FSI International Receives Follow On Orders From International Customers For Its ZETA® Spray Cleaning System

MINNEAPOLIS (Dec. 21, 2004) -- FSI International, Inc. (Nasdaq: FSII) today announced that the company has received repeat orders for its 300-mm ZETA® Spray Cleaning System. The repeat order from a leading IC manufacturer based in Taiwan will be used for front-end-of-line (FEOL) surface preparation at the 90-nm technology node and the ZETA System ordered by a major microprocessor manufacturer will be used for back end applications.

The repeat order from the Taiwanese customer is the result of the ZETA System’s successful performance in a 65-nm joint development program. The System demonstrated the ability to meet the customer’s aggressive process performance requirements with significantly less chemical consumption than competing single wafer wet cleaning systems with the added benefits of less capital investment and footprint when compared to competing wet benches.

“Global semiconductor manufacturers continue to recognize that the ZETA System’s performance, productivity and cost advantages make it the clear choice for a broad range of cleaning applications,” said Don Mitchell, FSI chairman and CEO. “These repeat orders are a testament to the high degree of satisfaction with the ZETA System’s capabilities and production performance. The ZETA System offers customers the advantage of high throughput batch processing, while providing the short cycle times required by IC manufacturers.”

FSI’s ZETA Spray Cleaning System includes fully automated configurations for 200- and 300-mm wafer sizes and semi-automated configurations for 200- and 150-mm wafer sizes. The ZETA System is proven for a wide range of applications, including FEOL resist strip and post-ash clean, back-end-of-line (BEOL) post-ash clean, salicide strip, wafer bumping and wafer reclaim. The system uses centrifugal spray technology; wafers undergo dry-in, dry-out processing in a closed, nitrogen-purged chamber. FSI's versatile chemical delivery technology prepares the chemicals at controlled composition and temperature and delivers them directly onto the wafers. ZETA Systems are priced from $1.0 to $2.8 million.

More than 1,000 FSI batch spray tools are currently being used in semiconductor production worldwide.

FSI International Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics manufacturing. Using the Company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals.

The Company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.

FSI maintains a Web site at www.fsi-intl.com.

 

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