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FSI International (ticker: FSII,
exchange: NASDAQ) News Release - 1/12/04
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FSI International and Solid State Technology/PennWell
Announce First Quarter 2004 Process Outlook Forum™ Schedule
MINNEAPOLIS (January 12, 2004) – FSI International, Inc.
(Nasdaq: FSII) today announced the first quarter 2004 schedule
for the popular Process Outlook Forum™ seminar series. These
web-based seminars are designed as non-commercial, open symposiums
that bring together professionals from throughout the semiconductor
industry to focus on future IC processing challenges for a wide
range of functional areas. The seminars, co-sponsored by Solid
State Technology/PennWell, are held monthly.
The schedule of first quarter 2004 Process Outlook Forum seminars
is as follows:
- Wednesday, January 21, 10
a.m. Central Standard Time — “The Use of ‘Dry’
CO2-based Technologies for the Enhanced Fabrication of Microelectronic
Devices,” by Dr. Joseph DeSimone, department of chemistry,
University of North Carolina at Chapel Hill, and department
of chemical engineering, North Carolina State University.
- Wednesday, February 18, 10
a.m. Central Standard Time — “The Ultimate CMOS
Device,” by Dr. Howard Huff, senior fellow at International
SEMATECH.
- Tuesday, March 9, 10 a.m.
Central Standard Time — “Upcoming Challenges for
DRAM Manufacturing,” by Dr. Kuntack Lee, senior engineer
for the R&D Center of Samsung Electronics Co. LTD.
“The semiconductor industry is built upon rapidly-changing
technologies. As a service to the industry, FSI and Solid State
Technology/PennWell are providing an easy, convenient and free
means for industry professionals to hear the latest on a wide
range of processing areas from respected experts,” said
Don Mitchell, FSI chairman and CEO. “As the roadmap becomes
more challenging, we believe the best approach is to have on-going
dialogue about industry trends and challenges. We are gratified
that many industry professionals worldwide have found the information
sharing and discussion of ideas that occur in the Process Outlook
Forum to be of great value, and we are committed to bring another
year of excellent materials to our users.”
The 2003 Process Outlook Forum events attracted users from nearly
200 companies, including strong participation from across the
U.S., Europe and Asia. Approximately 75 percent of 2003 registrants
were employees of semiconductor manufacturers, material suppliers
or equipment companies.
"We are very pleased to continue our work with FSI International
in an effort to help move forward the advanced technologies needed
by global semiconductor manufacturers," said David Barach,
Publisher of Solid State Technology. "The non-commercial
nature of the Process Outlook Forum, combined with the outstanding
lineup of Forum speakers, will continue to help technical professionals
meet current and future IC processing challenges."
Registration for the Process Outlook Forum is free and open to
anyone at http://www.fsi-intl.com/forum.
The Process Outlook Forum, which was launched in March 2003, is
designed to provide value to engineers, researchers and others
in the semiconductor industry by addressing the full spectrum
of issues pertaining to IC process technology challenges. The
convenient, open format of the program allows registrants to access
and download the material, including presentations and an audio
MP3 recording, at any time – even weeks after an event takes
place.
FSI International, Inc. is a global supplier
of surface conditioning equipment technology and support services
for microelectronics manufacturing. Using the Company’s
broad portfolio of cleaning products, which include batch and
single-wafer platforms for immersion, spray, vapor and CryoKinetic
technologies, customers are able to achieve their process performance,
flexibility and productivity goals.
The Company’s support services programs provide product
and process enhancements to extend the life of installed FSI equipment
enabling worldwide customers to realize a higher return on their
capital investment.
FSI maintains a Web site at www.fsi-intl.com.
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