FSI International (ticker:
FSII, exchange: NASDAQ) News Release - 5/3/04
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May Process Outlook Forum™ to Feature International SEMATECH’s Wafer Cleaning and Surface Preparation Conference
FSI and Pennwell Increasing Collaboration with Other Organizations to Provide Expanded Access to Critical IC Manufacturing Issues Via Web-based Seminars
MINNEAPOLIS (May 3, 2004) -- FSI International, Inc. (Nasdaq:
FSII) and Solid State Technology/Pennwell today announced that
the May installment of the popular Process Outlook Forum™ seminar
series will be broadcast live from the International SEMATECH
2004 Wafer Cleaning and Surface Preparation Conference on May
6 from 8-9 a.m. Central Daylight Time. The event will feature
presentations titled “Challenges for Surface Preparation” by
Philips Semiconductor Principal Scientist Dr. D. Martin Knotter
and “Highlights of the 2003 ITRS Surface Preparation Roadmap” by
FSI International Chief Technologist Dr. Jeff Butterbaugh. Free
registration for the web-based seminar is available at www.fsi-intl.com/forum.
The Process Outlook Forum web-based seminar series is designed
as a non-commercial, open symposium that brings together professionals
from throughout the semiconductor industry to focus on future
IC processing challenges over a range of functional areas. The
free seminars are held monthly.
International SEMATECH’s Wafer Cleaning and Surface Preparation
Conference is scheduled for May 6-7 at the Omni Hotel in Austin,
Texas. “The conference is designed for the exchange and
understanding of current information about wafer cleaning, including
front-end, back-end, as well as environment, safety and health
issues,” said Dr. Naim Moumen, SEMATECH’s Advanced
Gate Cleans manager and one of the event organizers. “Researchers,
suppliers and end-users will meet to address wafer cleaning
needs providing attendees with an understanding of developing
technologies, solutions and limitations for wafer cleaning.”
“International SEMATECH’s Surface Preparation Conference
is focused on identifying upcoming challenges and potential
solutions in surface preparation for IC manufacturing, which aligns perfectly with the goals of FSI’s Process Outlook
Forum,” Dr. Butterbaugh said. “Dr. Knotter's keynote
presentation addressing key challenges in particle removal without
damage and without etching should be of particular interest
to our participants.”
Monthly registration for the Process Outlook Forum is free and
open to anyone at www.fsi-intl.com/forum.. The Process
Outlook Forum, which was launched in April 2003, is designed
to provide value to engineers, researchers and others in the
semiconductor industry by addressing the full spectrum of issues
pertaining to IC process technology challenges. The convenient,
open format of the program allows registrants to access and
download the material, including presentations and an audio
MP3 recording, at any time – even weeks after an event
takes place.
FSI International, Inc. is a global supplier of surface conditioning
equipment technology and support services for microelectronics
manufacturing. Using the Company’s broad portfolio of
cleaning products, which include batch and single-wafer platforms
for immersion, spray, vapor and CryoKinetic technologies, customers
are able to achieve their process performance, flexibility and
productivity goals.
The Company’s support services programs provide product
and process enhancements to extend the life of installed FSI
equipment, enabling worldwide customers to realize a higher
return on their capital investment.
FSI maintains a web site at http://www.fsi-intl.com.
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