FSI International (ticker: FSII, exchange: NASDAQ) News Release - 11/09/04
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European IC Manufacturer Orders Multiple ANTARES® CryoKinetic Cleaning Systems Following Successful Evaluation Program

MINNEAPOLIS (November 9, 2004) -- FSI International, Inc. (Nasdaq: FSII) today announced that a leading European IC manufacturer has purchased multiple ANTARES® CX CryoKinetic Cleaning Systems after a successful demonstration of defect removal in an on-site evaluation program. The systems will be used on advanced devices for both front-end-of-line (FEOL) and back-end-of-line (BEOL) defect removal on planar and surface patterned structures. Revenue for these systems is expected to be recorded during the first half of fiscal 2005.

“As a result of the ANTARES system’s strong process performance, it is being inserted into high volume manufacturing,” said Don Mitchell, FSI International chairman and CEO. “This customer and others are finding that the ANTARES CryoKinetic technology is very effective at defect removal and is replacing traditionally used technologies for device manufacturing without causing damage to sensitive patterned structures. We have placed several evaluation systems with customers and are seeing strong interest in this technology all over the world. These orders mark the 13th integrated circuit fab to utilize the ANTARES system’s leading-edge enabling technology.”

This evaluation validated the defect reduction benefits of the CryoKinetic technology as experienced by other ANTARES system users. Many customers have found that ANTARES systems dramatically increase yield, reduce device ramp time and provide an outstanding return on investment.

The ANTARES system is a fully automated, single-wafer, CryoKinetic system for 300-mm and 200-mm wafers with a field-proven history of removing surface particle defects and improving customer yields. The AspectClean™ process, which was introduced in September 2003, provides the defect reduction capability necessary to allow users to use the ANTARES system for advanced processes. The ANTARES system provides an all-dry, nonreactive method of removing defects from FEOL and BEOL planar and patterned structures, including low-k structures, without damage and without altering the k value or physically damaging the interconnect, which delivers a clear advantage over traditional methods.

FSI International Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics manufacturing. Using the Company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals.

The Company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.

FSI maintains a Web site at www.fsi-intl.com.

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