FSI International (ticker: FSII,
exchange: NASDAQ) News Release - 6/21/05
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FSI International’s ANTARES® CryoKinetic
Technology Continues To Build Worldwide Momentum at the 90nm Technology
Node
Momentum highlighted by strong third quarter ANTARES System orders
and shipments
MINNEAPOLIS (June 21, 2005) -- FSI International, Inc. (Nasdaq:
FSII) today announced strong activity in the third quarter of
fiscal 2005 from leading IC manufacturers in Europe, Asia-Pacific,
Japan and the United States for its ANTARES® CryoKinetic Cleaning
Systems. The adoption of the ANTARES system, traditionally used
for back-end-of-line (BEOL) defect removal, continues to grow
as more customers move 90nm device technologies into high-volume
manufacturing.
In addition, recent innovations in the tool’s nozzle design
and process capabilities extend the ANTARES system to front-end-of-line
(FEOL) defect removal applications -- most notably, the removal
of particles on fragile gate structures without any damage or
etching of surface materials.
“The ANTARES system continues to gain momentum with new
and repeat customers around the globe, and we anticipate this
interest to grow as more 90nm device manufacturing moves into
high volume and future technology nodes come online,” said
Don Mitchell, FSI chairman and CEO. “CryoKinetic technology
gives IC makers a reliable and proven approach to improving yields
in advanced device manufacturing, where the advent of copper,
porous low-k and other new materials and sensitive structures
demand damage-free cleaning methods.”
More than 10 leading device manufacturers recognize the ANTARES
system for its defect reduction and yield improvement benefits.
During the third fiscal quarter, FSI received follow-on orders
from several semiconductor manufacturers, shipped evaluation systems
to prospective new customers, received an additional evaluation
order after a successful lab demonstration and received an initial
order from a new customer.
The ANTARES system is a fully automated, single-wafer, CryoKinetic
platform for 300mm and 200mm wafers. The tools offer a field-proven
history of removing surface particle defects and improving customer
yields. The AspectClean™ process provides the defect reduction
capability users need in advanced device processing. The ANTARES
system provides an all-dry, nonreactive method of removing defects
from FEOL and BEOL planar and patterned structures, including
low-k structures, without damage and without altering the k value
or physically damaging the interconnect, which delivers a clear
advantage over traditional methods.
FSI International, Inc. is a global supplier of surface conditioning
equipment technology and support services for microelectronics
manufacturing. Using the Company’s broad portfolio of batch
and single-wafer cleaning products, which include process technologies
for immersion, spray, vapor and CryoKinetic, customers are able
to achieve their process performance, flexibility and productivity
goals.
The Company’s support services programs provide product
and process enhancements to extend the life of installed FSI equipment,
enabling worldwide customers to realize a higher return on their
capital investment.
FSI maintains a Web site at http://www.fsi-intl.com.
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