FSI International (ticker: FSII, exchange: NASDAQ) News Release - 6/30/05
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FSI International Introduces New Cleaning Processes for Advanced Technology Nodes

New Processes Meet Customer Needs Well Ahead of ITRS Schedule

MINNEAPOLIS (June 30, 2005) -- FSI International, Inc. (Nasdaq: FSII) today announced new cleaning processes to meet the needs of leading IC makers well ahead of the International Technology Roadmap for Semiconductors (ITRS) guidelines for material loss. The ITRS calls for a maximum material loss per cleaning cycle of 0.4 angstrom at the 45nm technology node, while semiconductor manufacturers indicate their requirements are closer to 0.1 angstrom.

Working closely with customers, FSI has simultaneously advanced its three major cleaning technologies: cryogenic aerosol, spray and immersion. This portfolio of solutions enables customers to select the technology and tool set that best meet their requirements. Moreover, FSI is offering these advancements both as upgrades on installed equipment and as standard features on new tools.

“Our customers on the leading edge of technology tell us that the industry roadmap for surface preparation requirements and material loss at the 65nm and 45nm nodes are not aggressive enough for their needs,” said Dr. Scott Becker, FSI vice president of marketing. “By partnering closely with customers, FSI has developed a portfolio of solutions for cleaning processes that meet or exceed their actual requirements. We are working with our customers to optimize these solutions and integrate them into their manufacturing flows. In many cases, these advancements will enable our customers to extend the use of their existing FSI equipment.”

The solutions include:

Cryogenic aerosol – Advancements to FSI’s ANTARES® CryoKinetic Cleaning technology have produced zero-etch, damage-free cleaning on sensitive structures. Cryogenic aerosol, a unique technology that cleans the wafer surface without chemicals, can be used virtually anywhere in the IC manufacturing process. Advancements include a new nozzle design and a re-optimized AspectClean™ process that remove particles from advanced technology devices with no material loss, and no damage to narrow structures in both FEOL and BEOL.

Spray – Enhancements to FSI’s ZETA® Spray Cleaning System’s inherently damage-free batch spray process have been focused on FEOL post-ash cleaning (PAC) for 65nm and 45nm technologies. FSI has re-engineered PAC formulations in its spray process to take advantage of hydrodynamic forces to meet the IC manufacturer’s actual defectivity and material-loss requirements. Based on successful evaluations at leading fabs, FSI has demonstrated that these manufacturing requirements can be met at a low cost of ownership.

Immersion – Advancements include the new MegaLens™ Acoustic Diffuser for use with FSI’s MAGELLAN® Immersion Cleaning System. The MegaLens Accoustic Diffuser removes “hot spots” resulting in a more uniform energy field in the immersion process tank. This advancement will allow chip makers to turn their megasonics back on to achieve higher yields while avoiding damage to fragile patterns.

FSI International, Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics manufacturing. Using the Company’s broad portfolio of batch and single-wafer cleaning products which include process technologies for immersion, spray, vapor and CryoKinetic, customers are able to achieve their process performance, flexibility and productivity goals.

The Company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.

FSI maintains a web site at http://www.fsi-intl.com.

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