FSI International (ticker: FSII, exchange: NASDAQ) News Release - 10/17/06
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FSI International Introduces New Silicon Nitride Selective Etch Processes using its MAGELLAN® Immersion Cleaning System

MINNEAPOLIS (November 14, 2006) -- FSI International, Inc. (Nasdaq: FSII) announced today new selective nitride etch processes that suppress oxide and silicon attack without generating high particle counts using its MAGELLAN® Immersion Cleaning System. These applications were developed and proven in the FSI laboratory on customer wafers as part of a 45nm advanced technology program. These applications will be useful for older technology generations as well.

While IC manufacturers continue to add new elements and materials for the production of advanced devices, they are also increasing the use of standard materials such as silicon nitride. New nitride layers are being added to the manufacturing process to meet integration challenges such as strained channel engineering. During the device manufacturing process, these nitride films often need to be selectively removed from the wafer surface. IC makers are faced with making a decision between high selectivity and low particle counts when etching nitride films. FSI’s new processes allow IC makers to achieve high selectivity while maintaining low particle counts.

“FSI continues to extend its commitment to developing unparalleled cutting-edge surface conditioning technology. After successful evaluations, these results are further validation of the MAGELLAN system’s superior process capabilities,” said Don Mitchell, FSI International chairman and CEO. “Customers’ positive reactions to these highly selective nitride removal processes affirm that there is growing opportunity for technology enabling applications.”

The MAGELLAN system is a 200/300mm bridge tool, designed to meet the challenges of advanced IC development and manufacturing through its unparalleled process performance and configurability. Contributing to its industry-leading capabilities are FSI’s proprietary surface tension gradient (STG®) rinse/dry, SymFlow® etch and MegaLens™ megasonic particle removal technologies. The MAGELLAN system process is watermark-free on all surface types, and it delivers precise, ultra-uniform film etching, high-particle removal efficiencies and exceptional defect control. The MAGELLAN system selling price ranges from $2.0 to $4.0 million, depending on the number of modules and final configuration.

FSI International, Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics manufacturing. Using the Company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. FSI maintains a web site at http://www.fsi-intl.com.

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