FSI International (ticker:
FSII, exchange: NASDAQ) News Release - 12/11/07
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FSI International Announces Breakthrough in Metal Stripping
for Silicide Formation
New innovation enables cost effective adoption of low temperature annealed nickel platinum silicide
MINNEAPOLIS (December 11, 2007) -- FSI International, Inc. (Nasdaq: FSII) today announced it has adapted the FSI ViPR™ technology to successfully remove unreacted metal films after salicide formation. By implementing this new process, IC makers can achieve dramatic reductions in chemical usage and capital requirements for cobalt, nickel and nickel platinum silicide integration schemes. FSI ViPR™ technology is available on new FSI ZETA® Spray Cleaning System orders and as an upgrade to more recently installed systems in the field.
Nickel platinum silicide was adopted on 65nm logic devices because it offered significant device performance improvement due to its lower resistivity. In its early adoption, it proved challenging to remove the unreacted nickel and platinum while not attacking the nickel platinum silicide regions. In 2005, FSI solved this problem with the introduction of its nickel platinum stripping process.
As experience increased with nickel platinum silicide, IC manufacturers observed that junction leakage can be reduced by lower salicide formation temperatures. However, this lower temperature process creates other complications with the metal removal step prohibiting a yield-effective integration scheme. The new FSI ViPR™-based process does not have this limitation, and as such enables a low cost, yield-effective implementation of the low temperature annealed nickel platinum silicide process.
“By continuing to expand our ViPR™ process to solve more manufacturing problems, our customers receive the benefit of continuous productivity and process improvement,” said Don Mitchell, FSI chairman and CEO. “We are always pleased to offer new solutions on existing tool sets, further reducing customer costs while providing extendibility to future technology generations.”
FSI's ViPR™ technology was first introduced for all wet photoresist removal in 2006 as a method to eliminate the ash step in the photoresist mask removal sequence. Eliminating asher induced damage results in lower material loss, shortens cycle time and lowers overall capital investment. The ViPR™ technology is currently implemented in manufacturing by several of the world's largest integrated circuit manufacturers.
The ZETA® system uses centrifugal spray combined with versatile chemical delivery technology to prepare chemicals at a controlled composition and temperature for dispensing directly onto wafers. The ZETA® systems are proven for a wide range of applications, including Co and Ni etch for salicide formation, PR strip and post-ash clean, non-megasonic particle removal and wafer reclaim.
About FSI
FSI International, Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics manufacturing. Using the Company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. FSI maintains a web site at http://www.fsi-intl.com.
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