“Non-Damaging Cleaning Processes for Porous Low-k Materials,” by Philip G. Clark and Darren L. Moore (LSI Logic), presented at Advanced Metallization Conference, October 19–21, 2004.
Equipment
“Strategies for Second-Hand Equipment in China,” SI China, January 2005
Since 1991, FSI has been represented in Japan by mFSI, a joint venture with Mitsui & Co., Ltd. and Chlorine Engineers Corp., Ltd. mFSI’s integration of FSI products and local service and support has been welcomed by Japanese customers over the years. At Semicon Japan, December 1–3, 2004, mFSI booth attracted over 600 visitors and the models of FSI’s three 300mm products – MAGELLAN®, ZETA®, and ANTARES® Systems – drew much interest (view photos from the event).
Looking Ahead
Visit FSI at Semicon China March 15–17, Shanghai (more >)
Listen to FSI present “Non-Damaging Photoresist Strip Process for Copper/Low-k Interconnects” and “Advanced Cryogenic Aerosol Cleaning: Application to Damage Free Cleaning of Sensitive Structured Wafers (Co-authored with Altis) at ASMC Conference, April 11th, Munich (more >)
Listen to FSI present “Development and Application of a Non-Damaging Aerosol Process for the FEOL (Co-authored with Altis) and “Acoustic Diffuser for Damage-Free Megasonic Cleaning” at SEMATECH Conference, April 19–20, Austin, Texas
