|
Hot Topic |
Nano-Scale Surface Engineering Demands Ultra-Uniformity Learn More ... |
New Publications |
FEOL and BEOL Post-Ash Clean
“Batch Spray Processors: Reducing Cycle Time and Improving Performance,” by Erik Olson (FSI) and Byron Palla (TI), published in Semiconductor Technology, July 2004
 
“Strategies for Cycle Time Reduction in Batch Cleaning,” by Jeffery Butterbaugh, Proceedings: Advanced Semiconductor Manufacturing Conference, May, 2004 (more >)
BEOL Particle Removal
“Particle Removal Challenges and Solutions for the Nano-Technology Era,” by Thomas J. Wagener and Jeffery W. Butterbaugh, published in Solid State Technology, July 2004 (more >)
“Improved Yields for the Nano-Technology Era Using Cryogenic Aerosols,” by Thomas J. Wagener (FSI) and Kazushi Kawaguchi (Fujitsu), Proceedings: Advanced Semiconductor Manufacturing Conference, May, 2004 (more >)
Critical Clean
“HF-Based Cleaning Processes for Current Applications and New Materials in an Advanced Immersion Cleaning System,” by Nampyo Lee, published in Microelectronics, April 2004
“Better Repeatability Through Automated Etch Control,” by Jerry Zhao (ASMC) and Mark Ge (FSI), published in Semiconductor Technology, volume 29, issue 5, pages 31-34, May 2004 (more >)
Enter the Technical Library to access all technical publications. |
Customer Care News |
| ZETA and MERCURY System Upgrades
For photoresist strip and post-ash clean applications, Low Etch Clean upgrade minimizes material loss and increases particle removal efficiency, and FlashClean™ Advantage reduces defectivity at small particle sizes and improves productivity. (more >)
Surface Preparation Seminars
FSI held our 4th Annual Surface Conditioning Symposium in Chaska, MN. The keynote presentation by Dr. C. Rinn Cleavelin (Manager of Devices/Manufacturing External R&D in Silicon Technology Development, TI) was broadcast live via the Process Outlook Forum.
Read a summary of the symposium and view photos from the event.
SEMICON West 2004
FSI had a very successful SEMICON West. FSI once again built on their success of using 1/3 scale models to display products by adding MAGELLAN and ANTARES models, displayed with the pre-existing ZETA 300mm model. We've also included links to press pick up found in Semiconductor International and WaferNews.
|
Looking Ahead |
- Process Outlook Forum: Next Seminar on August 26th, presented by Dave Coldren, KLA-Tencor (more >)
- SEMICON Taiwan: Visit FSI at Booth #824 Hall One, Taipei World Trade Center, September 13–15, 2004 (more >)
- UCPSS 2004 Conference: September 20–22, 2004, Brussels, Belgium (more >)
- FSI Knowledge Services™ Seminar Series: October 18, 2004, Dresden Germany, October 20, 2004, Grenoble, France and October 22, 2004, Catania, Italy (more >)
|
|
