FSI International, Inc. • OTS Newsletter

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August 2005

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ITRS Public Conference Reveals Continuing Surface Preparation Challenges Learn More ...

FSI in the News

FSI International Launches the EcoBlend™ Process Series of Cost-Effective Dilute Acid Cleaning Solutions for Post-Ash Residue Removal

FSI International Introduces New Cleaning Processes for Advanced Technology Nodes. New Processes Meet Customer Needs Well Ahead Of ITRS Schedule.

FSI International’s ANTARES® CryoKinetic Technology Continues To Build Worldwide Momentum at the 90nm Technology Node. Momentum highlighted by strong third quarter ANTARES® System orders and shipments.

FSI International Announces New PlatNiStrip™ Process for Nickel Platinum Films. Development to Help IC Manufacturers Implement Salicide Formation at 65-nm.

FSI Receives Follow-on Order from Asian Foundry for ZETA® Spray Cleaning Systems. Six Asian Foundries are Using the ZETA® System Based on its Low Cost of Ownership and Flexibility.

New Publications

BEOL Particle Removal
"Using cost-effective dilute-acid chemicals to perform postetch interconnect cleans," by Hong-Seong Sohn, Samsung Electronics; and Jeffery W. Butterbaugh, Erik D. Olson, John Diedrick, and Nam-Pyo Lee, FSI International, published in MICRO, June 2005, Vol. 23, NO.5, pp. 67–77.

FEOL Critical Clean
“Advanced Immersion Batch Cleaning Processes Using Advanced and Flexible Configurations,” by Jeffery W. Butterbaugh and Nam-Pyo Lee, FSI International, published in Solid State Technology - China, March/April 2005

High-k
“The Litmus Test ’Selective Etching of High-k Dielectric Films’,” by Kurt Christenson, FSI, published in European Semiconductor, June 2005

FEOL and BEOL Particle Removal
“Advanced Cryogenic Aerosol Cleaning: Application to Damage Free Cleaning of Sensitive Structured Wafers,” by Jeffery M. Lauerhaas, James F. Weygand and Greg P. Thomes, FSI, Proceedings: Advanced Semiconductor Manufacturing Conference 2005

FEOL and BEOL Post-ash Clean
“Non-Damaging Chemical Photoresist Strip Process for Copper Low-k Interconnects,” by Philip G. Clark and Curt Christenson (FSI), presented at SEMI Advanced Semiconductor Manufacturing Conference 2005

Enter the Technical Library to access all technical publications.

Customer Care News

SI China Wafer Cleaning Seminar

On July 21, 2005, FSI’s Dr. Charles Lin, director of Asia Pacific product management, presented at SI China’s Wafer Cleaning Seminar, held in Shanghai. Dr. Lin’s presentation was entitled “High PRE, Low Etch FEOL Post-Ash Clean” and discussed FSI’s spray technology’s advantages in this increasingly important application, as seen by numerous customers on the FSI ZETA® System. Are you interested in learning more? Click here to request more information.

Knowledge is Power

It’s not too late to learn more about damage-free particle removal, advanced wet resist strip, surface prep for 65nm and beyond transistor formation, plus more industry hot topics. You too can get the power of knowledge like the SEMICON West visitors that stopped by the FSI booth. SEMICON West proved to be an excellent venue to build on the success of the FSI Knowledge Services™ Global Seminar Series. These mini-sessions held in the FSI booth, reflected our commitment to provide value-added knowledge to worldwide customers.

View a complete list of topics and request more information about any of the hot industry topics

View Photos from SEMICON West 2005

FSI Knowledge Services™ Global Seminar Series

A world-leading surface preparation specialist since 1973, FSI has always believed in providing not only the best equipment, but also knowledge and experience so customers can get more out of the equipment. Through the FSI Knowledge Services™ Seminar Series, FSI brings this value-added knowledge to our worldwide customer base locally. Since launching the global seminar series in 2004, we’ve held seminars in locations throughout Asia, Europe and at Semicon West in the US.

The Asia FSI Knowledge Services™ Seminars were recently held in Hsinchu on 9 August, Seoul on 11 August, and Shanghai on 16 August. To learn more about the program, agenda topics and to request information go to http://www.fsi-intl.com/knowledge.

Look for more information in the near future on the US seminar series – to be held in the spring of 2006.

These sessions offer you a wonderful opportunity to refresh and update your knowledge in surface conditioning – both the upcoming trends and fundamental knowledge.

Morning sessions: Short course by Prof. Srini Ragahavan from University of Arizona
Afternoon sessions: Presentations by FSI and various world-leading IC makers.

Looking Ahead

Semicon Taiwan 2005

FSI is your partner for 90nm production and has qualified products and processes for your 65nm manufacturing challenges. If you're now looking for a development partner for 45nm processes – FSI is your best choice in surface conditioning. High-k pre-clean, Cu/porous low-k cleaning, NiSi (and NiPtSi) strip, low material loss and damage-free particle removal are just some of the areas that we are experts in. Click here for more information, and visit us at booth #824 to preview the data and discuss your requirements.