FSI is focused on delivering semiconductor wafer cleaning products and processes that enable IC manufacturers to meet their cost, yield and device performance goals. Whether in FSI’s demonstration and development lab or IC manufacturing facilities, FSI works for and with customers to develop, demonstrate and integrate solutions to meet their specific needs.
FSI has been a leading provider of cleaning technologies for more than 35 years. Today, FSI offers a complete range of proven single wafer and batch platforms for immersion, spray, vapor and cryokinetic cleaning applications.
FSI International’s ZETA® System ViPR™ Process Identified as a Key Technology for Ultra-High Dose Ion Implantation in CMOS Applications
ZETA system ViPR process reduces surface damage and material loss associated with other approaches for removing implanted photoresist
FSI Knowledge Services™ Seminar Series ASIA 2008
The FSI Knowledge Services™ Seminar Series returns to Asia to bring you practical semiconductor surface conditioning knowledge, while creating an opportunity for interaction and discussion with other IC industry professionals. Presentations from FSI and several leading IC manufacturers in Asia will address industry trends and implementation of surface preparation technology in IC processing.
FSI Ships Single Wafer Cleaning Technology Selected by a Major Semiconductor Manufacturer for Development of 32nm BEOL Cleaning Processes
New single wafer wet cleaning technology addresses needs of low-k materials and metal film stacks used in 32nm devices.