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Product Detail

Discover a new world of immersion capabilities

MAGELLAN® Immersion Cleaning System

In direct response to customer input, the MAGELLAN® System sets new standards in immersion technology.

  • Shorter cycle time: Reduce your production time by up to 40% through MAGELLAN® System’s multi-function tanks with super-efficient mixing.
  • Breakthrough versatility and extendibility: Reduce your capital outlay. One MAGELLAN® System can support multiple processes and successive technology nodes.
  • Process performance: Improve yield and reduce learning curve with MAGELLAN® System’s patented technologies.
  • Ultra-small footprint: Conserve your valuable cleanroom space with modular configuration, up to 40% smaller than traditional wet benches.

Applications:
FEOL critical clean, FEOL photoresist strip and post-ash clean, Oxide etch, Nitride etch, wafer reclaim

Features:

  • Modular configuration from 2 to 7 process modules
  • Proprietary chemical mixing manifold on each process module, with variable valve control and Advanced Process Control
  • STG® (Surface Tension Gradient) rinse/dry technology for watermark-free dry based on Marangoni principle
  • SymFlow® in-situ oxide etching with APC etch control
  • Controlled, variable thickness DIO3 oxide regrowth
  • Advanced megasonics capabilities
  • Advanced robotics and materials management that is fast, flexible, reliable, and aids process performance

Available configurations:

  • Fully automated 300mm
  • Fully automated 200mm (bridging to 300mm)
MAGELLAN® 300 System

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The premier line of batch spray processors

ZETA® Spray Cleaning System

From FSI International, the world’s leader in batch spray processing, the ZETA® System offers the ultimate performance and productivity for high contaminant removal applications.

  • High performance: Get the process repeatability you demand, since all wafers receive the same fresh chemistry and are monitored with APC features throughout processing.
  • Balance of throughput and cycle time: The high throughput of batch processing now has unprecedented short cycle time, through FlashClean™ Advantage, a package of hardware, software, and process advancements.
  • Flexibility: Proprietary chemical mixing manifold enables you to switch between processes on the same tool, with no downtime.

Improvements in Photoresist Strip and Post–Ash Clean (PDF, 68 KB)

Applications:
BEOL post-ash clean, FEOL post-ash clean and photoresist strip, FEOL film strip, FEOL critical clean

Features:

  • Proprietary chemical mixing manifold, with variable valve control and Advanced Process Control
  • Single-pass chemistry use, or onboard temperature-controlled recirculation for specialty chemistries
  • Ozone processing (piranha replacement) option

Available configurations:

  • Fully automated 300mm
  • Fully automated 200mm
  • Semi-automated 200mm
  • Semi-automated 150mm
ZETA® 300 System

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Light years ahead for better yield today

ANTARES® Cryokinetic Cleaning System

Some leading IC manufacturers climb the yield curve faster than others, and one reason for their success is the ANTARES® System. The ANTARES® System allows customers to remove defects more effectively and apply in places not addressable by traditional methods of particle removal. Typical ROI results in 1 to 3 months.

  • Particle removal with the all-dry, non-reactive, and brushless CryoKinetic technology
  • Safe and effective on sensitive new materials such as Cu and low-k, unlike wet and scrubber methods that can alter material properties
  • More effective in particle removal than scrubbers in customer comparison

Applications:
FEOL and BEOL particle removal

Available configurations:

  • Fully automated 300mm (bridging to 200mm)
  • Fully automated 200mm (bridging to 300mm)
ANTARES® 300 System

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Economical, semi-automated batch spray processor

MERCURY® Spray Cleaning System

From FSI International, the world’s leader in batch spray processing, the MERCURY® System satisfies your processing needs at a low cost.

  • Low COO
  • High throughput
  • Small footprint

Improvements in Photoresist Strip and Post–Ash Clean (PDF, 68 KB)

Applications:
FEOL post-ash clean and photoresist strip, FEOL film strip, FEOL critical clean

Features:

  • Proprietary chemical mixing manifold, with variable valve control
  • Single-pass chemistry use
  • Options include ozone processing (piranha replacement)

Available configurations:

  • Semi-automated 200mm
  • Semi-automated 150mm
  • Semi-automated 125mm
  • Semi-automated 100mm
MERCURY® System

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POLARIS® Microlithography Clusters

FSI International offers Refresh™ Microlithography Clusters to be used in a wide variety of applications. These coat and develop systems provide excellent performance at competetive prices. Our worldwide installed base is growing, as we continue to enhance and improve POLARIS® systems throughout the world. Refresh systems offered are:

  • POLARIS® 2000
  • POLARIS® 2100/2200
  • POLARIS® 2500
  • POLARIS® 3500

Learn more about the Refresh Program™

Request a CD of available POLARIS® upgrades

POLARIS® Cluster

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POLARIS® Systems & Services

FSI is committed to providing a path for customers to enhance and extend the life of their existing POLARIS® Systems. In addition, we offer POLARIS systems under our Refresh™ program, and have established a key support services program that includes:

  • Software maintenance services
  • Process support on-site retainer services
  • Engineering retainer services
  • Maintenance on-site retainer services
  • Experienced staff of technical support specialists
  • Robot refurbishment
  • System-level and standard upgrades
  • Training
  • Spare parts
POLARIS® Cluster

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